Abstract: A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.

Abstract: A dispensing pump includes first and second sleeve assemblies. Each sleeve assembly includes a rotary valve having an input and output position and a longitudinally displaceable piston that moves between a first position abutting the valve and a second position displaced from the valve. The sleeve connects to a manifold with input and output passages that align with input and output apertures in the sleeve. Withdrawing the piston with the input port of the valve aligned with the input aperture draws material into the sleeve. Moving the piston toward the valve in the output position with the output port aligned with the output passage displaces material from the manifold.