Abstract: An improved lead socket insert assembled into a contact member which is adapted to pluggably receive a lead of a circuit component, such as an integrated circuit package is provided. The insert has a hollow cylindrical body portion and fingers that are bent at a fulcrum position so that they converge. The insert has improved operational characteristics which engage a component lead with greatly reduced mating forces due to a weakening at the fulcrum position. The lead socket insert allows for higher density application of electronic packages when assembled into loose contact members or directly mounted into an interconnection panel.