Abstract: A Ferritic stainless steel, non Ferritic stainless steel or carbon steel based lead frame and method for producing same is provided. The lead frame is preferably used for TantalumNiobium capacitors but could possibly be applicable to other integrated circuits with the same operating parameters. Any reference to Tantalum capacitors in this application applies equally to Niobium capacitors unless otherwise noted. The lead frame is prepared by choosing one of Ferritic stainless steel, non Ferritic stainless steel or carbon steel as a base metal and rolling it to a final required thickness. The base metal is then preferably plated with a nickel strike or other conventional barrier layer and then with final outer plating layers(s). The exact thickness and choice of layering varies and can be tailored to meet the requirements of each lead attach process.

Abstract: A method for forming a metal tube includes providing a flat sheet of metal, forming features in the sheet, forming a strip within the sheet, the features being disposed within the strip, progressively forming the strip into a barrel, and trimming the barrel from the sheet.

Abstract: For locking a test board connector to a printed wiring board, the connector includes a resilient member with a foot at its distal end and tabs positioned beneath the body of the connector. The foot and tabs extend in opposite directions. Lugs, which are molded to the bottom of the body of the connector serve to align the connector with an opening of the printed wiring board during attachment of the connector to the board. Both the tabs and resilient member are connected to the lugs.