Patents Assigned to MICRO-STAR INT'L CO., LIMITED.
  • Patent number: 11818869
    Abstract: A heat dissipation structure assembly includes an elastic limiting member, a thermal grease wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The thermal grease wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the thermal grease wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the thermal grease wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the thermal grease wall.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: November 14, 2023
    Assignees: MICRO-STAR INT'L CO., LIMITED., MSI ELECTRONIC (KUN SHAN) CO., LTD.
    Inventors: Cheng-Lung Chen, Chia-Ming Chang
  • Patent number: 11742603
    Abstract: An input/output transmission interface assembly capable of being assembled on a motherboard includes a first transmission interface, a board-to-board connector, and a second transmission interface. The first transmission interface includes a first circuit board, a first electrical connector, a driving chip, and a plug portion. The plug portion is at one side of the first circuit board for being plugged into the motherboard. The second transmission interface includes a second circuit board and a second electrical connector. The second circuit board is substantially parallel to the first circuit board. The board-to-board connector is assembled on and between the first circuit board and the second circuit board. The first circuit board and the second circuit board are electrically connected with each other through the board-to-board connector.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: August 29, 2023
    Assignees: MICRO-STAR INT'L CO., LIMITED., MSI COMPUTER (SHENZHEN) CO., LTD.
    Inventors: Tung-Yi Tsai, Chung-Hsing Chang, Kuo-Wei Lu
  • Patent number: 10838465
    Abstract: An electronic apparatus shell cover includes a body, a dust blocking screen, and a plurality of structural ribs. The body includes an opening and a plurality of assembling grooves. The opening penetrates through the body. The assembling grooves are on a second surface of the body and adjacent to the opening. The dust blocking screen includes a screen surface and a plurality of assembling parts. The screen surface is mounted in the opening and coplanar with a first surface of the body. The assembling parts are disposed in the assembling grooves. The structural ribs are connected to the first surface of the body and on the dust blocking screen. The dust blocking screen is coplanar with the first surface, and the internal accommodating space of the electronic apparatus shell cover is increased. Furthermore, the structural ribs can increase mechanical strength of the shell cover, can enhance heat exchange efficiency.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: November 17, 2020
    Assignees: MICRO-STAR INT'L CO., LIMITED., MSI ELECTRONIC (KUN SHAN) CO., LTD.
    Inventors: Chung-Bi Lee, Ming-Kan Chang, Guo-Chen Hsieh, Jia-Jun Hong