Patents Assigned to Micro-Tec Company, Ltd.
  • Patent number: 6568321
    Abstract: Laser beams 94 and 95 of laser emitters 74 and 75 are applied to work positioning marks 54 and 55 vertically before attaching a screen plate 60. Then, for attaching the screen plate 60 to frame fixing units 66 and 67, the screen plate 60 is fixed to the frame fixing units 66 and 67 so that the laser beams 94 and 95 are applied to plate positioning marks 64 and 65.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: May 27, 2003
    Assignee: Micro-Tec Company, Ltd.
    Inventor: Toshio Sakamoto
  • Publication number: 20020195007
    Abstract: Screen printing is performed by using a pressure squeegee, a main squeegee, and a scraper squeegee. Since a screen is pressed by the pressure squeegee in advance, an angle between the main squeegee and the screen is kept constant. After printing is finished by the main squeegee, the scraper squeegee scrapes a remaining ink.
    Type: Application
    Filed: August 27, 2002
    Publication date: December 26, 2002
    Applicant: Micro-Tec Company, Ltd.
    Inventors: Yasushi Sano, Osamu Tanaka
  • Patent number: 6494132
    Abstract: Screen printing is performed by using a pressure squeegee, a main squeegee, and a scraper squeegee. Since a screen is pressed by the pressure squeegee in advance, an angle between the main squeegee and the screen is kept constant. After printing is finished by the main squeegee, the scraper squeegee scrapes a remaining ink.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: December 17, 2002
    Assignee: Micro-Tec Company, Ltd.
    Inventors: Yasushi Sano, Osamu Tanaka
  • Patent number: 6264097
    Abstract: This invention provides screen printing for forming a higher solder ball (bump). In first printing step, a first solder layer is printed. After drying in drying step, a second solder layer is printed on the first solder layer in second printing step. Then, in re-flow processing step, re-flow processing is performed, and the first solder layer and the second solder layer are melted. Finally, the melted layer is solidified in a ball shape to form the solder ball (bump). Since solder paste is printed in layers, an amount of the solder paste can be increased. Hence, a higher solder ball (bump) can be formed.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: July 24, 2001
    Assignee: Micro-Tec Company, Ltd.
    Inventor: Yasushi Sano
  • Patent number: 6176179
    Abstract: The present invention aims to achieve a screen printer which will not result in uneven printing which may occur depending on the printed positions. The moving position of squeegee is detected by the sensors. The pressure control unit adjusts a degree of opening and closing the valve depending on the moving position of squeegee, and adjusts the pressure P generated by the air cylinder. By decreasing the pressure P at center and increasing the pressure P at both edges of a work, the work is printed without any unevenness.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: January 23, 2001
    Assignee: Micro-Tec Company, Ltd.
    Inventor: Yoshiaki Tagami
  • Patent number: 5699732
    Abstract: This invention is aimed at achieving a high-tension combination stretch screen. First, a print screen-mesh is bonded to a supporting screen-mesh at a bonding area. Then a portion of the supporting screen-mesh overlapping the print screen-mesh is removed. Then a new supporting screen-mesh is bonded to the bonding area, and again, a portion of the supporting screen-mesh overlapping the print screen-mesh is removed. Doubly fixed supporting screen meshes thus provide sufficiently increased tension to the print screen-mesh.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: December 23, 1997
    Assignee: Micro-Tec Company Ltd.
    Inventor: Yasushi Sano