Patents Assigned to Microassembly Technologies, Inc.
  • Patent number: 8295027
    Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: October 23, 2012
    Assignee: MicroAssembly Technologies, Inc.
    Inventors: Michael Bennett Cohn, Ji-Hai Xu
  • Publication number: 20120193754
    Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 2, 2012
    Applicant: MicroAssembly Technologies, Inc.
    Inventors: Michael B. Cohn, Ji-Hai Xu
  • Patent number: 8179215
    Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: May 15, 2012
    Assignee: MicroAssembly Technologies, Inc.
    Inventors: Michael Bennett Cohn, Ji-Hai Xu
  • Patent number: 7750462
    Abstract: Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: July 6, 2010
    Assignee: Microassembly Technologies, Inc.
    Inventors: Michael Bennett Cohn, Joseph T. Kung
  • Patent number: 7692521
    Abstract: Problems with the short lifetime of MEMS devices, low actuation forces, contaminant build-up on contacts, etc. are minimized by a MEMS device with an improved cantilever design that enables high force while maintaining large gaps. The improved cantilever design both allows for high force and fast switching while minimizing damage to contacts. The improved design can be fabricated on one or two substrates, which are bonded together with a seal ring to provide a packaged MEMS device.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: April 6, 2010
    Assignee: Microassembly Technologies, Inc.
    Inventor: Michael B. Cohn
  • Publication number: 20080272867
    Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.
    Type: Application
    Filed: October 30, 2007
    Publication date: November 6, 2008
    Applicant: MICROASSEMBLY TECHNOLOGIES, INC.
    Inventors: Michael B. Cohn, Ji-Hai Xu
  • Patent number: 7276789
    Abstract: Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: October 2, 2007
    Assignee: Microassembly Technologies, Inc.
    Inventors: Michael B. Cohn, Joseph T. Kung
  • Patent number: 6872902
    Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: March 29, 2005
    Assignee: MicroAssembly Technologies, Inc.
    Inventors: Michael B. Cohn, Ji-Hai Xu
  • Patent number: 6853067
    Abstract: Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: February 8, 2005
    Assignee: Microassembly Technologies, Inc.
    Inventors: Michael B. Cohn, Joseph T. Kung