Patents Assigned to MicroBase Technology Group
  • Publication number: 20110277491
    Abstract: A heat dissipation system includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct. The cooling device includes a housing, and an orifice plate dividing an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and formed with multiple micro orifices each having a diameter ranging from 5 to 1000 micrometers. The condenser includes a fluid inlet, a condensing chamber and a fluid outlet. The vapor conveying duct connects a vapor outlet of the housing and the fluid inlet of the condenser. The cooling liquid conveying duct connects a cooling liquid inlet of the housing and a fluid outlet of the condenser.
    Type: Application
    Filed: February 3, 2011
    Publication date: November 17, 2011
    Applicant: MicroBase Technology Group
    Inventors: Ching-Ping Wu, Kai-An Cheng, Chun-Hsien Wu, Ju-Hong Lin, Chia-Chen Liao, Hsien Meng, Hsien-Chun Meng