Abstract: A heat dissipation system includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct. The cooling device includes a housing, and an orifice plate dividing an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and formed with multiple micro orifices each having a diameter ranging from 5 to 1000 micrometers. The condenser includes a fluid inlet, a condensing chamber and a fluid outlet. The vapor conveying duct connects a vapor outlet of the housing and the fluid inlet of the condenser. The cooling liquid conveying duct connects a cooling liquid inlet of the housing and a fluid outlet of the condenser.