Patents Assigned to Microbonds, Inc.
  • Patent number: 7360675
    Abstract: An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical connection with the uninsulated end-portion of said insulated wire. A stationary electrical contact is provided for connecting to a ground. The stationary electrical contact is further configured to be placed about the shaft. A conductive bearing is also provided. The conductive bearing is configured to be placed about the shaft and between the electrical connector and the electrical contact. The conductive bearing electrically couples the electrical connector to said stationary electrical contact, thereby providing said ground to said uninsulated end-portion of said insulated bond wire. A wire-bonder including such a contact device and a method for making such a wire-bonder are also provided.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: April 22, 2008
    Assignee: Microbonds, Inc.
    Inventors: John I. Persic, Young-Kyu Song, Morgan Lee Upshall, Juan Florencio Munar
  • Publication number: 20030234275
    Abstract: A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wire holder being sized and shaped to permit a free end of the insulated wire to extend from the wire holder when the bond head is in the spaced apart position. A source of insulated wire for said bond head is provided as well as an electrical discharge wand positioned adjacent to said bond head when the bond head is in the spaced apart position. The wand directs sufficient electricity at the extending free end of the insulated wire to form a bond ball on the free end. A ground associated with the insulated wire, is provided the ground being sized and positioned to conduct electrical energy away from the insulated bond wire to prevent the insulation on the bond wire remote from the free end from being damaged.
    Type: Application
    Filed: November 20, 2002
    Publication date: December 25, 2003
    Applicant: Microbonds, Inc.
    Inventors: Robert J. Lyn, John I. Persic, Young-Kyu Song