Abstract: The present invention is directed to a permanent epoxy photoresist composition useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more epoxy resins according to Formulas I-VI, (B) one or more cationic photoinitiators; (C) one or more film casting solvents; and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed composition.

Abstract: The present invention is directed to a printable composition, comprising: 0.5 to 60 wt % of a polymer selected from the group consisting of epoxy, Novolac and poly(dimethylglutarimide); and 40-99.5 wt % of a solvent composition comprising (1) a high boiling point solvent having a flash point greater than about 10° C. and a boiling point greater than about 130° C. and (2) a low boiling point solvent having a flash point less than 30° C. and a boiling point less than or equal to 130° C., all weight percents based on the total weight of the composition. The present invention is also directed to methods of forming patterned substrates using the above compositions. The compositions of the invention are useful for printing electronic materials onto a substrate using a piezo-electric printer.

Abstract: The present invention is directed to a printable composition, comprising: 0.5 to 60 wt % of a polymer selected from the group consisting of epoxy, Novolac and poly(dimethylglutarimide); and 40-99.5 wt % of a solvent composition comprising (1) a high boiling point solvent having a flash point greater than about 10° C. and a boiling point greater than about 130° C. and (2) a low boiling point solvent having a flash point less than 30° C. and a boiling point less than or equal to 130° C., all weight percents based on the total weight of the composition. The present invention is also directed to methods of forming patterned substrates using the above compositions. The compositions of the invention are useful for printing electronic materials onto a substrate using a piezo-electric printer.

Abstract: A photoimagable composition suitable for use as a negative photoresist comprising: (A) at least one epoxidized polyfunctional bisphenol A formaldehyde novolak resin; (B) at least one polycaprolactone polyol reactive diluent, wherein the amount of component (A) is from about 95% to about 75% by weight of the sum of (A) and (B) and the amount of component (B) is from about 5% to about 25% by weight of the sum of (A) and (B); (C) at least one photoacid generator in an amount from about 2.5 to about 12.5 parts per hundred parts of resin and reactive diluent, which initiates polymerization upon exposure to actinic radiation; and (D) a sufficient amount of solvent to dissolve (A), (B) and (C); wherein the solvent comprises 2-pentanone, 3-pentanone, and 1,3-dioxolane and mixtures thereof.

Abstract: Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).

Abstract: A composition useful as a lift-off resist comprising at least one solvent, at least one polydimethylglutarimide (PMGI) resin and at least one selected deep-UV absorbing molecule of Formula I, where X is an aromatic or aliphatic bridging group, and Ar and Ar′ are aryl groups wherein at least one Ar or Ar′ contains one or more hydroxyl or carboxylic acid groups

Abstract: A photoimageable composition suitable for use as a negative photoresist comprising about 75% to about 95% by weight of at least one epoxidized polyfunctional bisphenol A formaldehyde novolak resin; about 5% to about 25% by weight of at least one polyol reactive diluent; and at least one photoacid generator in an amount from about 2.5 to about 12.5 parts per hundred parts of resin and reactive diluent, which initiates polymerization upon exposure to near-ultraviolet radiation; dissolved in a sufficient amount of coating solvent.

Abstract: An alkaline soluble maleimide tetrapolymer of Formulae I or II prepared by the free radical polymerization of the monomers maleimide, N-alkyl maleimide, (methyl)methacrylate and either (meth)acrylic acid or (meth)acrylate: wherein R is an alkyl having I to 4 carbon atoms; each R1, R2 and R3 is individually selected from hydrogen or methyl; each m is the mole fraction of maleimide and has a value of 5 to 20%, each n is a mole fraction of N-alkyl maleimide and has a value of about 50 to 70%, each x is the mole fraction of methyl(meth)acrylate and has a value of about 15 15 to 30%, y is the mole fraction of (meth)acrylic acid and has a value 3 to 12%, and z is the mole fraction of (meth)acrylamide and has a value of about 4 to 15%, wherein the values of m, n, x, y in Formula I and m, n, x and z in Formula II are such that the total nitrogen content of the maleimide tetrapolymer is at least about 6.5% by weight of the polymer.

Abstract: A composition useful for a thick-film negative resist comprising a mixture of at least one epoxidized polyfunctional bisphenol A formaldehyde novolak resin and at least one photoacid generator in a coating solvent, a majority amount of said coating solvent being cyclopentanone.

Abstract: Compositions useful for a lift-off resist in a bilayer metal lift-off process which comprise a mixture of at least one solvent, at least one polyglutarimide resin and an effective amount of at least one dissolution rate modifier selected from a group consisting of 2,3,4,2′,3′,4′-hexahydroxybenzophenone; hexahydroxyspirobiindane; 2,4,2′,4′-tetrahydroxybenzophenone; 1,1,1-tris-hydroxyphenylethane; 1,7-bis-(hydroxy-3-methoxyphenyl)-1,6-heptadiene-3,5-dione and at least one arylsulfonate ester of these poly-hydroxy aromatic compounds.

Abstract: A composition useful for a thick-film negative resist comprising a mixture of at least one epoxidized polyfunctional bisphenol A formaldehyde novolak resin and at least one photoacid generator in a coating solvent, a majority amount of said coating solvent being cyclopentanone.

Abstract: Compositions useful for a lift-off resist in a bilayer metal lift-off process, which comprise a mixture of at least one solvent, at least one polyglutarimide resin and an effective amount of at least one actinic-absorbing dissolution rate modifier having the formulae of (IA) or (IB): in which each R1 and R2 is selected from the group consisting of hydrogen, unsubstituted or substituted alkyl, alkoxy, nitro, halo, amide or hydroxy or a combination thereof, X is an aromatic group and R3 and R4 are selected from the group consisting of hydrogen, an unsubstituted or substituted alkyl or arylsulfonyl; each m is an integer from 1 to 5 and each n is an integer from 1 to 4.