Abstract: Provided are a tungsten precursor compound to which a substituent is bonded so as to obtain thermal stability and a method of forming a tungsten-containing film using the precursor.
Type:
Grant
Filed:
March 16, 2016
Date of Patent:
April 14, 2020
Assignee:
MICROCHEM INC.
Inventors:
Sam Keun Lee, Jong Taik Lee, Jun Young Lee, Ho Seob Kim
Abstract: The present invention relates to a tungsten precursor compound to which a substituent is bonded so as to obtain thermal stability and a tungsten-containing film in a mild condition at a high yield, and a process for producing the same. The present invention also provides a method for depositing tungsten-containing film.
Type:
Application
Filed:
March 16, 2016
Publication date:
July 26, 2018
Applicant:
MICROCHEM INC.
Inventors:
Sam Keun LEE, Jong Taik LEE, Jun Young LEE, Ho Seob KIM