Abstract: A copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding and in the vicinity of the copper pillar bumps only. The organic insulation layer, typically a thin film polymer layer, acts as a barrier layer for the copper pillar bumps to protect the semiconductor wafer during the copper pillar flip chip bonding process. The copper pillar bump semiconductor packaging method limits the areas where the organic insulation layer is applied to reduce the stress introduced to the semiconductor wafer by the organic insulation layer. In another embodiment, a copper pillar bump semiconductor packaging method patterns an organic insulation layer formed under the copper pillar bumps to areas surrounding the copper pillar bumps and along the path of a redistribution layer without using a large and continuous organic insulation layer.

Abstract: A single integrated circuit package for controlling the charging circuits of a battery charger. The single integrated circuit package comprises a microcontroller, switch mode power supply controller(s), analog to digital converter and analog input multiplexer which may be fabricated on a single integrated circuit die, or the microcontroller may be on one integrated circuit die, and the remaining aforementioned circuits may be on a second integrated circuit die. The switch mode power supply controller is adapted for connection to a power converter which is used to control the voltage and/or current to a battery being charged. The power converter may also be on the same integrated circuit die as the switch mode power supply controller, or may be on a separate semiconductor die but included in the single integrated circuit package. Single or multiple batteries may be charged using charging algorithms specifically tailored to each battery.