Patents Assigned to Microclad Laminates Limited
  • Production of dielectric boards
    Patent number: 4781991
    Abstract: Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.
    Type: Grant
    Filed: October 9, 1987
    Date of Patent: November 1, 1988
    Assignee: Microclad Laminates Limited
    Inventors: John E. Thorpe, Gursharan S. Sarang