Patents Assigned to MicroCoating Technologies of
  • Formation of thin film capacitors
    Publication number: 20020145845
    Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 10, 2002
    Applicant: MicroCoating Technologies of
    Inventors: Andrew T. Hunt, Tzyy Jiuan Hwang, Helmut G. Hornis, Wen-Yi Lin