Patents Assigned to Microcomponents and Systems Ltd.
  • Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method
    Patent number: 5661341
    Abstract: A method for manufacturing of a composite microelectronic structure with improved planarity of layers thereof.The method comprises masking of selected portion of electrically conductive layers with subsequent selective electrochemical anodic oxidation thereof and removing the mask.A composite structure, in particular MCM-D's manufactured by this method has improved connectivity density and performances.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 26, 1997
    Assignee: Microcomponents and Systems Ltd.
    Inventor: Shimon Neftin