Abstract: The present invention provides a temporary bonding method comprising: providing a stack comprising: a first substrate, an adhesive layer, a second substrate, and a sacrificial layer; and applying laser energy to the sacrificial layer to facilitate separation of the first substrate from the second substrate. The sacrificial layer in this invention is soluble in alkaline aqueous solution and therefore if there is a residual sacrificial layer, it can be easily removed with an alkaline aqueous solution to avoid damaging the component.

Abstract: The present invention provides a separator formed by hydrolysis of a resin film. The resin film comprises a non-hydrolyzable organic polymer; and a hydrolyzable organic polymer being hydrolyzable by treatment with at least one of an acid aqueous solution, an alkaline aqueous solution and pure water, wherein the content of the hydrolyzable organic polymer ranges from 10 parts by weight to 70 parts by weight relative to 100 parts by weight of the resin film. The separator of the present invention has good ion conductivity and thus, is extremely suitable for use in various types of batteries.

Abstract: The present invention provides a flexible display cover substrate, which comprises a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film. The hard coating composition includes a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle. According to the present invention, a flexible display cover substrate with low haze and good bending resistance can be obtained.

Abstract: The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 ?m.

Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.

Abstract: The present invention provides a polyimide film, which comprises a polyimide having a structure represented by formula (I): in which A is a residue group of an aromatic diamine containing a sulfonyl group in its main chain moiety, R1 is a residue group of an aromatic dianhydride, R2 is a residue group of an aliphatic dianhydride, m and n are each independently a positive integer, a diamine monomer constituting the polyimide is only composed of the aromatic diamine containing the sulfonyl group in its main chain moiety, and the polyimide is surface-dried at 75° C. to 155° C. in the process of forming the polyimide film. The polyimide film of the present invention has transparency and UV absorption properties.

Abstract: A flexible display cover substrate is provided, including a transparent polyimide film and a device protective layer. The device protective layer is formed by a hard coating layer disposed on at least one side of the transparent polyimide film, and the hard coating layer is composed of three or more reactive functional group compounds, an initiator, an elastic oligomer, a nano inorganic modified particle, and a fluorescent pigment. The flexible display cover substrate of the invention, after being folded by a radius of curvature of 1 mm, does not cause cracks on the surface of the hard coating layer or break the substrate, and the yellow index YI of the flexible display cover substrate is less than 2.0.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R1˜R5 are as defined herein.

Abstract: The present invention provides a polyamide-imide copolymer, which is obtained by copolymerizing an aromatic diamine monomer, a dianhydride monomer and an aromatic dicarbonyl monomer, wherein the aromatic diamine monomer comprises a diamine containing an amide group (—CONH2) represented by formula (1), and Q1, X1, X2, R1, R2, Y1, Y2 and m are as defined herein:

Abstract: The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.

Abstract: A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.

Abstract: The present invention provides a photosensitive resin composition comprising (a) a polyamide ester represented by formula (1); (b) a polyimide; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide in which A, B, R1, R2, and m have the meaning as defined herein.

Abstract: A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.

Abstract: A flexible display cover substrate is provided, including a transparent polyimide film and a device protective layer. The device protective layer is formed by a hard coating layer disposed on at least one side of the transparent polyimide film, and the hard coating layer is composed of three or more reactive functional group compounds, an initiator, an elastic oligomer, a nano inorganic modified particle, and a fluorescent pigment. The flexible display cover substrate of the invention, after being folded by a radius of curvature of 1 mm, does not cause cracks on the surface of the hard coating layer or break the substrate, and the yellow index YI of the flexible display cover substrate is less than 2.0.

Abstract: The present invention relates to an adhesive composition, which comprises an epoxy resin; and a polyimide comprising a repeating unit. The repeating unit comprises a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2): wherein X1, Y, Z, m, and n are as defined herein, the weight ratio of polyimide to the total amount of the epoxy resin is 50% to 100%, and in the epoxy resin, the proportion of the epoxy resin having a weight average molecular weight of less than 400 Da accounts for 12 to 40% by weight of the total amount of the epoxy resin. The adhesive formed by the adhesive composition of the present invention has a relatively high glass transition temperature.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) a filler selected from one or more of alumina, graphene, inorganic clay, silica, and zinc oxide and having a particle diameter ranging from 10 nm to 1.0 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.

Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) titanium dioxide having a particle size of 0.2 ?m to 10 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.

Abstract: A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 ?m.