Abstract: An adhesive composition with high frequency characteristics and the application thereof; wherein, the adhesive composition has a total weight of (A), (B) and (C) in 100 parts by weight, comprising: (A) 40-80 parts by weight of solvent-soluble polyimide; (B) 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; (C) 10-30 parts by weight of epoxy resin; and optionally comprising at least one of the following components: (D) flexibilizer; (E) flame retardant; (F) inorganic filler; (G) coupling agent; and (H) catalyst. The adhesive composition has the advantages of low dielectric constant, low dielectric loss, favorable heat resistance and low-temperature (<180° C.) adhesion. The adhesive composition can be used for preparing high-frequency protective membrane and high-frequency adhesive film.
Type:
Grant
Filed:
September 7, 2016
Date of Patent:
December 31, 2019
Assignee:
MICROCOSM TECHNOLOGY (SUZHOU) CO., LTD.
Inventors:
Donghai Du, Sih-Ci Jheng, Chao-Chin Chuang