Abstract: The present invention provides an ink jet composition including a thermosetting epoxy resin, a monofunctional acrylate monomer, a polyfunctional acrylate monomer, a photoinitiator, and an amine synergist. The ink jet resin composition according to the present invention may improve heat resistance, chemical resistance and adhesion of a cured resin layer obtained by curing the composition. In particular, in contrast to the conventional ink jet resin composition, the resin composition may be easily discharged (jetted) from an ink jet printer without using a solvent but even when using a diluent, thereby forming a resin insulating layer without influencing the characteristics of a printed wiring board.
Type:
Application
Filed:
May 16, 2017
Publication date:
July 9, 2020
Applicant:
MICROCRAFT KOREA CO., LTD.
Inventors:
Yorio Hidehira, Sung Ho Choi, Dong Heun Shin
Abstract: The present invention relates to a resin composition for inkjet printing used to form a resin layer serving as an insulation layer of a printed wiring board by an inkjet printing method.
Type:
Application
Filed:
March 21, 2018
Publication date:
July 2, 2020
Applicant:
MICROCRAFT KOREA CO., LTD.
Inventors:
Yorio HIDEHIRA, Sung Ho CHOI, Dong Heun SHIN
Abstract: The present invention provides a method of preparing an ink jet resin composition including preparing a liquid (a) including a thermosetting epoxy resin and a first non-volatile acryl compound, preparing a liquid (b) including a pigment and a second non-volatile acryl compound, preparing a liquid (c) including a photoinitiator and a third non-volatile acryl compound, and mixing the liquids (a), (b) and (c) and further including an amine synergist and a viscosity controlling agent to prepare a resin composition. According to the method of preparing an ink jet resin composition of the present invention, an ink jet resin composition may be easily prepared without using a volatile solvent but using acryl compounds as diluents, and the resin composition prepared thereby may have improved heat resistance, chemical resistance and adhesion.
Type:
Grant
Filed:
May 16, 2017
Date of Patent:
January 28, 2020
Assignee:
Microcraft Korea Co., Ltd.
Inventors:
Yorio Hidehira, Sung Ho Choi, Dong Heun Shin
Abstract: The present invention provides a method of preparing an ink jet resin composition including preparing a liquid (a) including a thermosetting epoxy resin and a first non-volatile acryl compound, preparing a liquid (b) including a pigment and a second non-volatile acryl compound, preparing a liquid (c) including a photoinitiator and a third non-volatile acryl compound, and mixing the liquids (a), (b) and (c) and further including an amine synergist and a viscosity controlling agent to prepare a resin composition. According to the method of preparing an ink jet resin composition of the present invention, an ink jet resin composition may be easily prepared without using a volatile solvent but using acryl compounds as diluents, and the resin composition prepared thereby may have improved heat resistance, chemical resistance and adhesion.
Type:
Application
Filed:
May 16, 2017
Publication date:
May 23, 2019
Applicant:
MICROCRAFT KOREA CO., LTD.
Inventors:
Yorio Hidehira, Sung Ho Choi, Dong Heun Shin