Patents Assigned to Microdermics Inc.
  • Metallic microneedles
    Patent number: 10589078
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: March 17, 2020
    Assignee: Microdermics Inc.
    Inventors: Boris Stoeber, Iman Mansoor, Urs Otto Häfeli
  • Metallic microneedles
    Patent number: 10207094
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: February 19, 2019
    Assignee: Microdermics Inc.
    Inventors: Boris Stoeber, Iman Mansoor, Urs Otto Häfeli
  • Metallic microneedles
    Patent number: 9675790
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: June 13, 2017
    Assignee: Microdermics Inc.
    Inventors: Boris Stoeber, Iman Mansoor, Urs Otto Häfeli