Patents Assigned to Microelectronic Modules Corp.
  • Preformed thermal fuse
    Patent number: 6373371
    Abstract: A preformed thermal fuse comprising two electrodes, at least one layer of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse.
    Type: Grant
    Filed: August 17, 1999
    Date of Patent: April 16, 2002
    Assignee: Microelectronic Modules Corp.
    Inventors: Bernhard E. Doerrwaechter, Keck C. Pathammavong, Kurt M. Krachenfels