Patents Assigned to Microelectronic Packaging Inc.
  • Patent number: 5808856
    Abstract: A high energy multilayer ceramic capacitor formed of alternating ceramic and electrode layers, the capacitor being suitable for use in implantable medical devices. The ceramic layers are comprised of a dielectric composition of lead magnesium niobate with small amounts of dopants, namely, lithium niobate, copper oxide, magnesium titanate, manganese niobate, and zirconium oxide, with appropriate electrical terminations connected to the electrode layers. The capacitor thus fabricated exhibits greatly reduced ferroelectric effect, namely, less than 30% over a bias range of 0-1,000 volts. It has a breakdown voltage of at least 700 volts, a leakage current less than 10 pico amps at 1,000 volts, an energy density of greater than 10 J/cc, has a rectangular form factor 1.5 inches by 2.0 inches by 0.06 inch thick, and weighs no more than 30 grams.
    Type: Grant
    Filed: December 12, 1996
    Date of Patent: September 15, 1998
    Assignee: Microelectronic Packaging, Inc.
    Inventors: William P. Bischoff, Michael G. Bischoff
  • Patent number: 5680685
    Abstract: A method of fabricating a large, rectangular, multilayer ceramic capacitor formed of alternating ceramic and electrode layers. Capacitors so formed have a high dielectric constant, extremely low leakage current and an extremely low dissipation factor. Exemplary capacitors can be made with a lead magnesium niobate dielectric composition powder to which is added several organic constituents, including a surfactant and a plasticizer, plus small amounts of several dopants, such as lithium niobate, copper oxide, magnesium titanate, manganese niobate and zirconium oxide. That total mixture is ball milled to form a slip with very small grain size. The slip is cast as a thin tape on a Mylar backing, cut into a plurality of blanks, and alternating layers of the green tape ceramic and electrode layers are laminated on a polyvinyl alcohol coated foundation plate. Firing and sintering steps are followed by application of electrical terminations to complete the capacitor.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 28, 1997
    Assignee: Microelectronic Packaging, Inc.
    Inventor: William P. Bischoff
  • Patent number: 5603147
    Abstract: A high energy multilayer ceramic capacitor formed of alternating ceramic and electrode layers, the capacitor being suitable for use in implantable medical devices. The ceramic layers are comprised of a dielectric composition of lead magnesium niobate with small amounts of dopants, namely, lithium niobate, copper oxide, magnesium titanate, manganese niobate, and zirconium oxide, with appropriate electrical terminations connected to the electrode layers. The capacitor thus fabricated exhibits greatly reduced ferroelectric effect, namely, less than 30% over a bias range of 0-1,000 volts. It has a breakdown voltage of at least 700 volts, a leakage current less than 10 pico amps at 1,000 volts, an energy density of greater than 10 J/cc, has a rectangular form factor 1.5 inches by 2.0 inches by 0.06 inch thick, and weighs no more than 30 grams.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 18, 1997
    Assignee: Microelectronic Packaging, Inc.
    Inventors: William P. Bischoff, Michael G. Bischoff
  • Patent number: 5013347
    Abstract: A structure for packaging semiconductor integrated circuits including a ceramic housing consisting of a base and cap having opposed mating surfaces for subsequent mating during a cap-to-base sealing operation that encapsulates an integrated circuit within the ceramic housing. Each of the base and cap mating surfaces having at least one thin sintered layer consisting of at least two sealing glass paste compositions sequentially printed onto each of the opposed mating surfaces before being sintered. The sealing glass paste compositions containing a mixture of glass powder and a liquid vehicle. A first of the compositions is characterized by having a glass-to-vehicle ratio range of 9:1 to 15:1 which is facilitated by having a liquid vehicle containing a mixture consisting of 93 wt % isotridecyl alcohol, 5 wt % diacetone acetate and 2 wt % acrylic resin and a glass powder selected from the group of LS0113, LS2001B, XS1175M, and T187 industry type glass powders.
    Type: Grant
    Filed: June 29, 1989
    Date of Patent: May 7, 1991
    Assignee: Microelectronic Packaging Inc.
    Inventors: Chew E. Seng, Wee T. Hork, Wong Y. Lee