Abstract: A system and method for producing thin, uniform powder phosphors for field emission display screens features a planarization of the phosphor powder layer. That planarization is accomplished by placing the deposited phosphor layer in an anode plate between two optical flats, which are then mounted within a mechanical press.
Type:
Grant
Filed:
June 7, 1995
Date of Patent:
December 16, 1997
Assignees:
Microelectronics and Computer Technology Corp., SI Diamond Technology, Inc.
Inventors:
Chenggang Xie, Donald E. Patterson, Nalin Kumar
Abstract: A field emission cathode for use in flat panel displays is disclosed comprising a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites each contain at least two sub-regions having differing electron affinities. Use of the cathode to form a computer screen is also disclosed along with the use of the cathode to form a fluorescent light source.
Type:
Grant
Filed:
June 7, 1995
Date of Patent:
November 11, 1997
Assignee:
Microelectronics and Computer Technology Corp.
Abstract: A multi-layered pattern recognition neural network that comprises an input layer (28) that is operable to be mapped onto an input space comprising a scan window (12). Two hidden layers (30) and (32) map the input space to an output layer (16). The hidden layers utilize a local receptor field architecture and store representations of objects within the scan window (12) for mapping into one of a plurality of output nodes. Each of the plurality of output nodes and associated representations stored in the hidden layer define an object that is centered within the scan window (12). When centered, the object and its associated representation in the hidden layer result in activation of the associated output node. The output node is only activated when the character is centered in the scan window (12). As the scan window (12) scans a string of text, the output nodes are only activated when the associated character moves within the substantial center of the scan window.
Type:
Grant
Filed:
April 20, 1993
Date of Patent:
August 8, 1995
Assignee:
Microelectronics and Computer Technology Corp.
Abstract: The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.
Type:
Grant
Filed:
September 29, 1992
Date of Patent:
October 25, 1994
Assignee:
Microelectronics and Computer Technology Corp.
Inventors:
Charles W. C. Lin, Chung J. Lee, Tom J. Hirsch, Kimcuc T. Tran
Abstract: A method for reflowing solder without flux includes the steps of placing a first metallic element in contact with a second, solder-plated element, thereby defining a bond site; and causing a laser beam to impinge on the bond site. An apparatus for performing the above method is also disclosed.
Type:
Grant
Filed:
June 12, 1990
Date of Patent:
November 17, 1992
Assignee:
Microelectronics and Computer Technology Corp.
Inventors:
Philip J. Spletter, Claire T. Galanakis, William G. Flynn
Abstract: An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with the liquid metal, and thereafter mixing a composition with a pestle element for mechanically amalgamating the composition. Other additives may be provided such as ductile metals, additives containing oxides, ceramics, or other non-metallic compounds, and volatile constituents. The amalgamated composition can then wet surfaces to be bonded and harden at or near room temperature.
Type:
Grant
Filed:
July 19, 1989
Date of Patent:
October 1, 1991
Assignee:
Microelectronics and Computer Technology Corp.