Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Abstract: An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.

Abstract: An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and, pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

Abstract: An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.

Abstract: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.