Abstract: The invention is a modified organic photoresist which is resistant to etching in oxygen-containing plasmas and therefore particularly useful for masking and etching organic polymer materials in VLSI and advanced packaging applications. The invention comprises adding a phosphorous-containing compound to a conventional photoresist. The phosphorous-containing compound is of a type and in an amount effective to substantially prevent etching of the modified photoresist in an oxygen-containing plasma without substantially adversely affecting the photosensitivity of the photoresist or the elasticity or the adhesion of the etch resistant film formed during oxygen-containing plasma exposure to an underlying material to be patterned and etched.

Abstract: A method and apparatus for rasterizing a two-dimensional fast Fourier transform of a size N.times.N using a pipelined butterfly computational unit with 2logN processors. The invention avoids the problems associated with transposing the matrix so that the data can be continuously driven into the arithmetic processors in a pipelined fashion. It is devised for realtime applications using raster scan or serial input and output devices.