Patents Assigned to Microfits & Methods Pte. Ltd.
  • Carrier for an integrated circuit package
    Patent number: 5085321
    Abstract: A carrier for an integrated circuit package comprises an integral moulding of resilient plastics material and comprising end portions (4) formed on one surface with ribs (7) defining channels (8) for package leads, and interconnected by side wall portions (5) to define a window (9). The package is located on the carrier overlying the window by blending the carrier so that undercut grippers (11) are moved apart to allow the package to pass between them, whereafter the package is gripped when the carrier readopts its normal configuration.
    Type: Grant
    Filed: April 12, 1990
    Date of Patent: February 4, 1992
    Assignee: Microfits & Methods Pte. Ltd.
    Inventor: Hwee S. Chew