Patents Assigned to Microlink Devices, Inc.
  • Patent number: 10923617
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 16, 2021
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Patent number: 10685843
    Abstract: Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to create a high intensity of ultraviolet light at the surface of the substrate or at one or more layers formed on the substrate. Etching rates in GaN substrates and GaN layers are improved by an order of magnitude over conventional systems. Systems and methods for forming a device structure free of a substrate are described. The device structure is grown or applied over a release layer on a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device structure from the substrate.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: June 16, 2020
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Robert McCarthy
  • Patent number: 10522363
    Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 31, 2019
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Robert McCarthy, Rekha Reddy
  • Patent number: 10214295
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: February 26, 2019
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 9650148
    Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 16, 2017
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 9356162
    Abstract: The present application utilizes an oxidation process to fabricating a Group III-V compound semiconductor solar cell device. By the oxidation process, a window layer disposed on a cell unit is oxidized to enhance the efficiency of the solar cell device. The oxidized window has an increased band gap to minimize the surface recombination of electrons and holes. The oxidized window also improves transparency at the wavelengths that were absorbed in the conventional window layer.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: May 31, 2016
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Christopher Youtsey, David S. McCallum, Victor C. Elarde, John M. Dallesasse
  • Patent number: 9315267
    Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: April 19, 2016
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20150255668
    Abstract: Methods of producing single-junction or multi-junction InP-based solar cells grown latticed-matched on a InP substrate or grown on metamorphic layers on a GaAs substrate, with the substrate subsequently removed in a nondestructive manner via the epitaxial lift-off (ELO) technique, and devices produced using the methods are described herein.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 10, 2015
    Applicant: MICROLINK DEVICES, INC.
    Inventor: Microlink Devices, Inc.
  • Patent number: 8993873
    Abstract: A solar cell structure is provided for reducing shadow losses without increasing series resistance in the solar cell device. The solar cell device may form an electrical contact to a solar cell emitter layer from the backside of the solar cell device. With this structure, the emitter contact shadow losses may be reduced significantly while simultaneously decreasing device series resistance.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: March 31, 2015
    Assignee: MicroLink Devices, Inc.
    Inventors: Christopher Youtsey, Francis Tuminello, Victor C. Elarde
  • Patent number: 8993366
    Abstract: The method of the invention includes the sequential steps of providing a plurality of solar cells, interconnecting the solar cells using one or more interconnect tabs, attaching the interconnect tabs to a top side of the solar cell to interconnect the plurality of solar cells by coupling an exposed top surface of a first solar cell to a top surface of an adjacent second solar cell, attaching one or more bypass diodes to a top side of the solar cell, then next applying an adhesive to a first film layer, placing the plurality of solar cells onto the first film layer, then next applying an adhesive to a second film layer, placing the plurality of solar cells and first film layer onto the second film layer to form a sheet assembly, and then forming the solar sheet from the sheet assembly.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: March 31, 2015
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Haruki Miyamoto
  • Patent number: 8912631
    Abstract: A heterojunction bipolar transistor (HBT) is provided with an improved on-state breakdown voltage VCE. The improvement of the on-state breakdown voltage for the HBT improves the output power characteristics of the HBT and the ability of the HBT to withstand large impedance mismatch (large VSWR). The improvement in the on-state breakdown voltage is related to the suppression of high electric fields adjacent a junction of a collector layer and a sub-collector layer forming a collector region of the HBT.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: December 16, 2014
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Andree Wibowo
  • Publication number: 20130133730
    Abstract: Methods of producing single-junction or multi-junction InP-based solar cells grown latticed-matched on a InP substrate or grown on metamorphic layers on a GaAs substrate, with the substrate subsequently removed in a nondestructive manner via the epitaxial lift-off (ELO) technique, and devices produced using the methods are described herein.
    Type: Application
    Filed: January 28, 2013
    Publication date: May 30, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: Microlink Devices, Inc.
  • Patent number: 8450162
    Abstract: Methods and systems for fabricating an integrated BiFET using two separate growth procedures are disclosed. Performance of the method fabricates the FET portion of the BiFET in a first fabrication environment. Performance of the method fabricates the HBT portion of the BiFET in a second fabrication environment. By separating the fabrication of the FET portion and the HBT portion in two or more separate reactors, the optimum device performance can be achieved for both devices.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: May 28, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Andree Wibowo
  • Patent number: 8440492
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: May 14, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Christopher Youtsey
  • Patent number: 8426237
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: April 23, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Christopher Youtsey
  • Publication number: 20130082239
    Abstract: A method of fabricating a light emitting diode using an epitaxial lift-off process includes forming a sacrificial layer on a substrate, forming a light emitting diode structure on the sacrificial layer with an epitaxial material, forming a light reflecting layer on the light emitting diode structure, and removing the sacrificial layer using an etching process to separate the substrate from the light emitting diode structure.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: MICROLINK DEVICES, INC.
  • Publication number: 20130037078
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Application
    Filed: October 11, 2012
    Publication date: February 14, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: MICROLINK DEVICES, INC.
  • Publication number: 20130034926
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Application
    Filed: October 11, 2012
    Publication date: February 7, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: MicroLink Devices, Inc.
  • Patent number: 8361827
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: January 29, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Christopher Youtsey
  • Publication number: 20120227798
    Abstract: The present application utilizes an oxidation process to fabricating a Group III-V compound semiconductor solar cell device. By the oxidation process, a window layer disposed on a cell unit is oxidized to enhance the efficiency of the solar cell device. The oxidized window has an increased band gap to minimize the surface recombination of electrons and holes. The oxidized window also improves transparency at the wavelengths that were absorbed in the conventional window layer.
    Type: Application
    Filed: May 29, 2012
    Publication date: September 13, 2012
    Applicant: MICROLINK DEVICES, INC.
    Inventors: Noren PAN, Christopher YOUTSEY, David S. MCCALLUM, Victor C. ELARDE, John M. DALLESASSE