Abstract: This invention relates to the field of silicon microphone technology, more specifically, to a method for fabricating a MEMS microphone using multi-cavity SOT wafer by Si—Si fusion bonding technology, which comprises a multi-cavity silicon backplate and a monocrystalline silicon diaphragm, both are separated with a layer of silicon dioxide to form the capacitor of the MEMS microphone. The monocrystalline silicon diaphragm has advantages such as low residual stress and good uniformity, which increase the yield and sensitivity of MEMS silicon microphone; the diaphragm comprises tiny release-assistant holes, spring structures with anchors and bumps which can quickly release the residual stress and reduce the probability of stiction between the backplate and the silicon diaphragm. This structure will further improve yield and reliability of MEMS microphone.

Abstract: This invention relates to the field of silicon microphone technology, more specifically, to a method for fabricating a MEMS microphone using multi-cavity SOT wafer by Si-Si fusion bonding technology, which comprises a multi-cavity silicon backplate and a monocrystalline silicon diaphragm, both are separated with a layer of silicon dioxide to form the capacitor of the MEMS microphone. The monocrystalline silicon diaphragm has advantages such as low residual stress and good uniformity, which increase the yield and sensitivity of MEMS silicon microphone; the diaphragm comprises tiny release-assistant holes, spring structures with anchors and bumps which can quickly release the residual stress and reduce the probability of stiction between the backplate and the silicon diaphragm. This structure will further improve yield and reliability of MEMS microphone.