Patents Assigned to Micrometal Technologies, Inc.
  • Patent number: 11246248
    Abstract: An RFI/EMI shielding material composed of a conductive multi-fiber having a plurality of metalized monofilaments, each monofilament having a core of stainless steel or low carbon steel with an initial diameter and at least two layers of metal or metal alloy electroplated on the core which is drawn after electroplating to a final diameter less than the initial diameter, in the range of about 45-80 ?m.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: February 8, 2022
    Assignee: Micrometal Technologies, Inc.
    Inventor: Thomas F. Burke
  • Publication number: 20140202757
    Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 24, 2014
    Applicant: MicroMetal Technologies, Inc.
    Inventors: Thomas F. Burke, James E. Haller
  • Patent number: 8722186
    Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: May 13, 2014
    Assignee: Micrometal Technologies, Inc.
    Inventors: Thomas F. Burke, James E. Haller
  • Patent number: 7923390
    Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: April 12, 2011
    Assignee: Micrometal Technologies, Inc.
    Inventors: Thomas F. Burke, James E. Haller
  • Publication number: 20090050362
    Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.
    Type: Application
    Filed: July 11, 2008
    Publication date: February 26, 2009
    Applicant: Micrometal Technologies, Inc.
    Inventors: Thomas F. Burke, James E. Haller
  • Patent number: 7113131
    Abstract: A metallized substrate, such as used to make a resonant circuit tag with inductive and capacitive elements in series, has a thin inorganic or polymeric dielectric layer formed on a metal layer. The inorganic layer may be formed by anodizing a surface of the metal layer. The organic layer may be formed by flexographic printing. In both cases, a via hole is formed through the dielectric layer. A second layer of very thin conductive metal is deposited on the dielectric layer and in the via hole. The substrate is subsequently patterned with an etch resist and then etched to form the inductor coil and the capacitor plates, which are interconnected via the metallized via hole.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: September 26, 2006
    Assignee: Micrometal Technologies, Inc.
    Inventor: Thomas F. Burke
  • Patent number: 6835412
    Abstract: A metallized substrate, such as used to make a resonant circuit tag with inductive and capacitive elements in series, has a thin inorganic or polymeric dielectric layer formed on a metal layer. The inorganic layer may be formed by anodizing a surface of the metal layer. The organic layer may be formed by flexographic printing. In both cases, a via hole is formed through the dielectric layer. A second layer of very thin conductive metal is deposited on the dielectric layer and in the via hole. The substrate is subsequently patterned with an etch resist and then etched to form the inductor coil and the capacitor plates, which are interconnected via the metallized via hole.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: December 28, 2004
    Assignee: Micrometal Technologies, Inc.
    Inventor: Thomas F. Burke
  • Patent number: 5449491
    Abstract: A method of producing diamond crystals from a metallofullerite matrix independent of external application of pressure is disclosed. The method comprises hyperquenching a portion of a metallic sold comprising a metal carbon matrix of an allotropic metal and metallofullerites of that allotropic metal after the portion has been heated to or near the critical temperature for its percentage composition of the allotropic metal, carbon, and other effective ingredients. The quenching is conducted rapidly enough to collapse fullerene structures present in the matrix into diamond crystals. The resulting metal-carbon matrix of an allotropic metal, metallofullerites of the allotropic metal, and diamond crystals are also disclosed.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: September 12, 1995
    Assignee: MicroMet Technology, Inc.
    Inventor: Robert C. Job