Abstract: A corrosion resistant thermowells with thin wall tips for use in unusually difficult industrial applications such as pharmaceutical and chemical process plants and semiconductor manufacturing facilities. These facilities have process environments that may include at least one of the following: highly corrosive fluids, difficult mechanical conditions such as rapid or turbulent fluid flows, and/or reasonably high process temperatures and/or pressures. The corrosion resistant thermowells provide isolation between a temperature sensor and a fluid to be measured.
Abstract: A PTFE jacketed tantalum tipped thermowell that can be used in unusually difficult industrial applications such as pharmaceutical and chemical process plants and semiconductor manufacturing facilities. These facilities have process environments that may include at least one of the following: highly corrosive fluids, difficult mechanical conditions such as rapid or turbulent fluid flows, and/or reasonably high process temperatures and/or pressures.
Abstract: A PTFE jacketed tantalum tipped thermowell that can be used in unusually difficult industrial applications such as pharmaceutical and chemical process plants and semiconductor manufacturing facilities. These facilities have process environments that may include at least one of the following: highly corrosive fluids, difficult mechanical conditions such as rapid or turbulent fluid flows, and/or reasonably high process temperatures and/or pressures.
Abstract: A valve seat and a valve assembly incorporating such valve seat form tight dual seals with glass lined nozzle of a reagent or reaction vessel. This reduces or eliminates cavities and crevices between the value seat and the nozzle where residues or contaminants can accumulate. Additionally, the present valve assembly comprises flush ports to permit the valve seat and the valve to be cleaned-in-place. This eliminates the need to disassemble the valve seat and/or the valve to remove the contaminants, thereby minimizing process “down time.
Type:
Grant
Filed:
November 17, 2004
Date of Patent:
April 11, 2006
Assignees:
Micromold Products, Inc., De Dietrich Process Systems, Inc.
Inventors:
Arthur S. Lukach, Jr., Joseph Nevadunsky