Patents Assigned to Micron Communication, Inc.
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Patent number: 5986570Abstract: Communications between an RFID interrogator and an RFID transponder require that no more than one transponder be present in the reading range of the interrogator and transmitting into motion at any given time. If multiple transponders are in the field, then a collision between the return signals of the transponders occurs, rendering the signals unreadable. A method to resolve the collisions and allow for accurate transmission of each transponder's data is given. This method is especially effective over other methods when the transponder is a read-only type of device, whereby there is no communications interrogator on board the read-only transponder.Type: GrantFiled: September 3, 1997Date of Patent: November 16, 1999Assignee: Micron Communications, Inc.Inventors: Donald L. Black, Dale Yones
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Patent number: 5983363Abstract: A plurality of battery-operated transceivers encapsulated by lamination to form a sheet of independent transceivers is tested in a two piece fixture that forms an enclosure surrounding each in-sheet transceiver. Each enclosure has an antenna for transmitting a command signal to the transceiver at a known power level and for receiving a reply message from the transceiver containing a power level measurement made by the transceiver. Test methods using the fixture of the present invention are also described.Type: GrantFiled: September 15, 1994Date of Patent: November 9, 1999Assignee: Micron Communications, Inc.Inventors: Mark E. Tuttle, Rickie C. Lake, Steven F. Schicht, John R. Tuttle
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Patent number: 5981102Abstract: In accordance with one aspect of the invention, a thin profile battery apparatus comprises at least two thin profile batteries conductively bonded to one another, with one of the batteries including portion which overhangs the other. In one implementation, the batteries comprise button type batteries. In one implementation, the two thin profile batteries are the same size and shape. In accordance with another aspect, a radio frequency communication device comprises a substrate having conductive paths including an antenna. At least one integrated circuit chip is mounted to the substrate and in electrical connection with a first portion of the substrate conductive paths. At least two thin profile batteries conductively bonded in series with and over one another and a second portion of the substrate conductive paths are included. One of the batteries has a portion which overhangs the other and is in electrical connection with a third portion of the substrate conductive paths.Type: GrantFiled: February 19, 1998Date of Patent: November 9, 1999Assignee: Micron Communications, Inc.Inventors: Ford B. Grigg, Rickie C. Lake
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Patent number: 5982237Abstract: A communications system including a clock recovery circuit that extracts a clock signal from incoming digital data, the clock recovery circuit comprising:a voltage controlled oscillator having a control node and having an output producing an output wave having a frequency that varies in response to a voltage applied to the control node; charge pump and loop filter circuitry that controls the rate of change of the voltage on the control node of the voltage controlled oscillator; a start-up circuit that performs frequency detection and, in conjunction with the charge pump and loop filter circuitry, adjusts the voltage on the control node of the voltage controlled oscillator; and a state machine that performs phase detection and adjusts the voltage on the control node of the voltage controlled oscillator.Type: GrantFiled: January 9, 1998Date of Patent: November 9, 1999Assignee: Micron Communications, Inc.Inventors: George E. Pax, James E. O'Toole, Dan M. Griffin
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Patent number: 5978230Abstract: Battery mounting apparatuses, electronic devices, and methods of forming electrical connections are described. In one implementation, a flexible circuit substrate has an area within which an electrical component, e.g. a thin-profile battery terminal housing member, is to be adhered. A conductive contact node pattern is disposed within the area and sized to be conductively adhered with the component. In one aspect, the conductive contact node pattern comprises an outer conductive node on the substrate at least a portion of which is positioned within the outermost 25% of the area. An electrical component is conductively bonded with the contact node pattern and encapsulating material is provided over and underneath the component. In a preferred aspect, the substrate and electrical component are vacuum processed sufficiently to redistribute the encapsulating material under the component.Type: GrantFiled: February 19, 1998Date of Patent: November 2, 1999Assignee: Micron Communications, Inc.Inventors: Ross S. Dando, Rickie C. Lake, Krishna Kumar
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Patent number: 5972152Abstract: Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.Type: GrantFiled: May 16, 1997Date of Patent: October 26, 1999Assignee: Micron Communications, Inc.Inventors: Rickie C. Lake, Mark E. Tuttle, Joseph P. Mousseau, Clay L. Cirino
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Patent number: 5973263Abstract: An encapsulation body for enclosing an electronic element is disclosed and which includes a first layer of a slow curing two-part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer and which substantially retains the first layer of material on the electronic element while the first layer of material is in a flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.Type: GrantFiled: August 18, 1997Date of Patent: October 26, 1999Assignee: Micron Communications, Inc.Inventors: Mark E. Tuttle, Joseph P. Mousseau, Clay L. Cirino
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Patent number: 5970398Abstract: An antenna circuit configured for use in a radio frequency data communications device has an antenna constructed and arranged to transfer electromagnetic waves, the electromagnetic waves corresponding to a signal carried by the antenna and generated from a signal source. A Schottky diode is electrically coupled in serial relation with the antenna, and in operation the signal is applied serially across the antenna and the diode in direct relation with electromagnetic waves transferred by the antenna. A bias current supply is also electrically coupled to the Schottky diode and is configurable to deliver a desired bias current across the current. The diode is responsive to the bias current to realize a desired diode impedance such that a desired impedance matched/mis-matched is provided between impedance of the diode and impedance of the antenna when the signal is applied across the antenna circuit, which selectively tunes the antenna circuit by imparting a desired power transfer therein.Type: GrantFiled: August 29, 1996Date of Patent: October 19, 1999Assignee: Micron Communications, Inc.Inventor: John R. Tuttle
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Patent number: 5963177Abstract: Methods of forming electronic signal transmitting/receiving devices and electronic signal transmitting/receiving devices are described. In one implementation, integrated circuitry including transponder circuitry is provided and operatively coupled with an antenna to provide a transmitting/receiving circuit. A matrix material comprising suspension structure is formed and applied over at least a portion of the antenna, the suspension structure being selected to manipulate an operating characteristic of the transmitting/receiving circuit. According to a preferred aspect of the invention, the operating characteristic comprises an electrical length of the antenna and the application of the matrix material effectively increases the electrical length to resonate the antenna at a desired frequency. According to another preferred aspect of the invention, the suspension structure comprises calcium carbonate.Type: GrantFiled: May 16, 1997Date of Patent: October 5, 1999Assignee: Micron Communications, Inc.Inventors: Mark E. Tuttle, Rickie C. Lake
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Patent number: 5952121Abstract: A button-type battery has an anode, a cathode, and an electrolyte encased with two terminal housing members. The terminal housing members have respective peripheries that are crimped together to form a fluid-tight seal. An insulating gasket is provided between the peripheries to electrically insulate the two terminal housing members. A porous separator physically separates the anode and cathode and extends between the terminal housing member peripheries at least partially into the fluid-tight seal. According to one aspect, the separator overlaps the gasket in the seal. According to another aspect, the separator and gasket are formed of a single, integral piece of material.Type: GrantFiled: June 9, 1998Date of Patent: September 14, 1999Assignee: Micron Communications, Inc.Inventors: Peter M. Blonsky, Mark E. Tuttle
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Patent number: 5937512Abstract: A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board material into at least one self supporting sheet; d) providing circuit traces atop the cured self supporting sheet; e) mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and f) peeling the temporary substrate and cured self supporting sheet from one another.Type: GrantFiled: January 11, 1996Date of Patent: August 17, 1999Assignee: Micron Communications, Inc.Inventors: Rickie C. Lake, Joe Mousseau, Mark E. Tuttle
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Patent number: 5919274Abstract: A method of forming a thin profile battery is disclosed. The battery includes two conductive terminal housing members separated by an "L" shaped annular gasket. The gasket includes a step portion thereon, wherein when said gasket is placed within one of the said housing members, the said member is crimped resulting in a portion of the gasket folded to contact the step portion.Type: GrantFiled: June 15, 1998Date of Patent: July 6, 1999Assignee: Micron Communications, Inc.Inventor: Mark E. Tuttle
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Patent number: 5914671Abstract: A system for locating an individual in a facility, the system including a portable wireless transponder device borne by the individual; an interrogator; and a plurality of antennas distributed in the facility, the antennas being selectively separately connected to the interrogator, the interrogator when connected to any of the antennas having a communications range covering less than the area of the entire facility, the interrogator being configured to repeatedly transmit a wireless command to the portable wireless transponder device using alternating antennas, the portable wireless transponder device being configured to transmit data identifying the portable wireless transponder device in response to a command if the portable wireless transponder device is within communications range of the antenna sending the command, the individual being locatable by determining with which antenna the interrogator was able to establish communications with the portable wireless transponder device.Type: GrantFiled: February 27, 1997Date of Patent: June 22, 1999Assignee: Micron Communications, Inc.Inventor: John R. Tuttle
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Patent number: 5907477Abstract: An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.Type: GrantFiled: March 11, 1997Date of Patent: May 25, 1999Assignee: Micron Communications, Inc.Inventors: Mark E. Tuttle, Rickie C. Lake, Joe P. Mousseau, Clay L. Cirino
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Patent number: 5906661Abstract: In one aspect, a method of making a battery includes fusing an alkali metal onto a patterned conductive layer.Type: GrantFiled: February 24, 1998Date of Patent: May 25, 1999Assignee: Micron Communications, Inc.Inventor: Rickie C. Lake
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Patent number: 5900333Abstract: A button-type battery includes, a) an anode; b) a cathode positioned adjacent to the anode; c) an electrolyte between the anode and the cathode; d) a conductive first terminal housing member in electrical contact with one of the anode or the cathode; the first terminal housing member having a periphery; e) a conductive second terminal housing member in electrical contact with the other of the anode or the cathode; the second terminal housing member having a periphery; f) the first and second terminal housing members forming an enclosed housing which holds and protects the anode, the cathode and the electrolyte; and g) the first and second terminal housing member peripheries being configured together to form an electrically insulative seal which seals the anode, the electrolyte and the cathode within the housing formed by the first and second terminal housing members, the electrically insulative seal comprising cross-linked butyl rubber.Type: GrantFiled: November 21, 1997Date of Patent: May 4, 1999Assignee: Micron Communications, Inc.Inventor: Rickie C. Lake
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Patent number: 5893207Abstract: A method of forming a thin-profile battery includes: a) masking an electrically conductive sheet with a material to which elemental lithium will not appreciably adhere to define a masked portion and an unmasked portion, the unmasked portion being in the shape of the desired electrode being formed; c) applying molten lithium to the masked sheet to cause elemental lithium to adhere to the unmasked portion but not appreciably adhere to the masked portion; alternately, directing a lithium stream onto the sheet; d) solidifying the lithium on the unmasked portion to in situ form a lithium electrode; and e) after solidifying, Joining battery terminal housing members to form the battery.Type: GrantFiled: July 10, 1997Date of Patent: April 13, 1999Assignee: Micron Communications, Inc.Inventor: Mark E. Tuttle
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Patent number: 5865859Abstract: In one aspect, a method of making a battery includes fusing an alkali metal onto a patterned conductive layer.Type: GrantFiled: April 15, 1997Date of Patent: February 2, 1999Assignee: Micron Communications, Inc.Inventor: Rickie C. Lake
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Patent number: 5866277Abstract: A button-type battery has an anode, a cathode, and an electrolyte encased with two terminal housing members. The terminal housing members have respective peripheries that are crimped together to form a fluid-tight seal. An insulating gasket is provided between the peripheries to electrically insulate the two terminal housing members. A porous separator physically separates the anode and cathode and extends between the terminal housing member peripheries at least partially into the fluid-tight seal. According to one aspect, the separator overlaps the gasket in the seal. According to another aspect, the separator and gasket are formed of a single, integral piece of material. One of the terminal housing members is substantially planar.Type: GrantFiled: June 3, 1997Date of Patent: February 2, 1999Assignee: Micron Communications, Inc.Inventors: Peter M. Blonsky, Mark E. Tuttle
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Patent number: 5863813Abstract: A method of processing a semiconductive material wafer includes, a) providing a semiconductive material wafer having integrated circuitry fabricated within discrete die areas on the wafer, the discrete die areas having bond pads formed therewithin; b) cutting at least partially into the semiconductive material wafer about the die areas to form a series of die cuts, the cuts having edges; c) depositing an insulative material over the wafer and to within the cuts to at least partially cover the cut edges and to at least partially fill the cuts with the insulative material; d) removing the insulative material from being received over the bond pads and leaving the insulative material within the die cuts; and e) after the removing, cutting into and through the insulative material within the die cuts and through the wafer. A semiconductor chip includes an outer surface having conductive bond pads proximately associated therewith. Side edges extend from the outer surface.Type: GrantFiled: August 20, 1997Date of Patent: January 26, 1999Assignee: Micron Communications, Inc.Inventor: Ross S. Dando