Abstract: A handpiece-type high-frequency vibration cutting device includes a housing (10); a vibration device (21); a holding member (11); a tool (12); and a controller (20) to control the operations of the vibration device (21). The controller (20) controls the vibration of the tool (12) due to the vibration device (21) such that the vibration is burst oscillation in which vibration and stop of vibration are repeated. The controller (20) also controls the entire burst frequency f1 of the tool (12) to be included in the range of 1 to 8 [Hz], one cycle of the burst frequency f1 including a burst period with the holding member (11) vibrating and a stop period with the tool (12) not vibrating. The controller (20) also controls the vibration frequency f2 of the tool (12) during the burst period such that the vibration frequency f2 is in the range of 20 to 60 [kHz].

Abstract: When a work W rotates counterclockwise about an axis Ow and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O1 and a grinding wheel (2) which rotates clockwise about an axis O2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S1 and a second stress sensor S2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.

Abstract: To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.

Abstract: Some implementations of the described invention provide an improved centerless grinding apparatus in which grinding is efficiently operated by reducing the idle time of the grinding wheel. While the described apparatus can comprise any suitable feature, in some cases, it includes a first regulating wheel and a second regulating wheel are axially aligned side by side. In some cases, a first grinding area is provided between the first regulating wheel and a first blade. In some cases, a second grinding area is provided between the second regulating wheel and a second blade. Additionally, in some cases, a grinding wheel is mounted on a grinding wheel Z-slide to be moved reciprocatively between the first grinding area and the second grinding area. In this way, grinding is efficiently operated by reducing the idle time of the grinding wheel.

Abstract: To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.

Abstract: To provide a centerless grinding method which facilitates a tooling change and enables automation. A blade 11 is disposed slidable along a first straight line 101, i.e., Y axis, a grinding wheel 7 is disposed slidable along a second straight line 102, i.e., X axis, and a regulating wheel 9 is disposed slidable along a third straight line 103 intersecting with the second straight line at an angle ?2. At a tooling change, then, the blade is moved in a negative direction of the Y axis with an increase in diameter of a workpiece, the grinding wheel is moved in a negative direction of the X axis with an increase in diameter of the workpiece, and the regulating wheel is moved in a positive direction of the Y axis and also in a positive direction of the X axis with an increase in diameter of the workpiece. With this, angles ? and ?, which a contact angular position reference line S makes with line segments OB and OR, are made always constant.

Abstract: To provide a centerless grinding method which facilitates a tooling change and enables automation. A blade 11 is disposed slidable along a first straight line 101, i.e., Y axis, a grinding wheel 7 is disposed slidable along a second straight line 102, i.e., X axis, and a regulating wheel 9 is disposed slidable along a third straight line 103 intersecting with the second straight line at an angle ?2. At a tooling change, then, the blade is moved in a negative direction of the Y axis with an increase in diameter of a workpiece, the grinding wheel is moved in a negative direction of the X axis with an increase in diameter of the workpiece, and the regulating wheel is moved in a positive direction of the Y axis and also in a positive direction of the X axis with an increase in diameter of the workpiece. With this, angles ? and ?, which a contact angular position reference line S makes with line segments OB and OR, are made always constant.

Abstract: In centerless grinding there are the in-feed and the through-feed scheme, each having their respective advantages and disadvantages. When a work being machined by centerless grinding has plural portions being machined, those portions can be distinguished as portions being machined suitable for in-feed and portions being machined suitable for through-feed. Then, the present invention, using the same centerless machine, performs through-feed grinding in the first half of the process, then automatically switches from that and performs in-feed grinding in the latter half of the process. Thus, in a single piece of work being machined, sites suited to through-feed grinding are subjected to through-feed grinding, and sites suited to in-feed grinding are subjected to in-feed grinding. Not only so, but it is unnecessary to alter the setup between the first half of the process and the latter half of the process, wherefore centerless grinding can be performed very efficiently.