Abstract: A delay circuit is coupled to a memory device. At least a portion of the delay circuit is disposed in one or more memory banks on one or more memory chips of the memory device. The delay circuit is configured to calibrate an asynchronous signal received at each of the one or more memory banks so that the calibrated asynchronous signal has a common timing relationship with a respective internal command signal received at the corresponding memory bank for all of the one or more memory banks on the memory device. The calibrated asynchronous signals are used in various internal test operations to improve testing accuracy.

Abstract: Systems, apparatuses, and methods related to bit string operations in memory are described. The bit string operations may be performed within a memory array without transferring the bit strings or intermediate results of the operations to circuitry external to the memory array. For instance, sensing circuitry that can include a sense amplifier and a compute component can be coupled to a memory array. A controller can be coupled to the sensing circuitry and can be configured to cause one or more bit strings that are formatted according to a universal number format or a posit format to be transferred from the memory array to the sensing circuitry. The sensing circuitry can perform an arithmetic operation, a logical operation, or both using the one or more bit strings.

Abstract: Methods of operating a memory, and apparatus configured to perform similar methods, include determining first states of a first sense node and a second sense node while a first voltage level is capacitively coupled to the first sense node and while a second voltage level is capacitively coupled to the second sense node, determining a second states of the first and second sense nodes while a third voltage level is capacitively coupled to the first sense node and while a fourth voltage level is capacitively coupled to the second sense node, determining a fifth voltage level in response to at least the first states of the first and second sense nodes and the second states of the first and second sense nodes, and determining third states of the first and second sense nodes while the fifth voltage level is capacitively coupled to the first and second sense nodes.

Abstract: A memory device includes a memory array, a plurality of voltage generation systems, and a controller. The memory array includes a plurality of planes. Each voltage generation system of the plurality of voltage generation systems is electrically coupled to a corresponding plane of the plurality of planes. The controller is configured to turn on each voltage generation system of the plurality of voltage generation systems in response to a first command to access a first plane of the plurality of planes.

Abstract: A system and apparatus for adjusting threshold program and erase voltages in a memory array, such as a floating gate memory array, for example. One such method includes applying a first voltage level to a first edge word line of a memory block string and applying a second voltage level to a second edge word line of the memory block string. Such a method might also include applying a third voltage level to non-edge word lines of the memory block string.

Abstract: Electronic apparatus and methods may include a hafnium tantalum oxynitride film on a substrate for use in a variety of electronic systems. The hafnium tantalum oxynitride film may be structured as one or more monolayers. The hafnium tantalum oxynitride film may be formed using atomic layer deposition. Metal electrodes may be disposed on a dielectric containing a hafnium tantalum oxynitride film.

Abstract: A system and apparatus for adjusting threshold program and erase voltages in a memory array, such as a floating gate memory array, for example. One such method includes applying a first voltage level to a first edge word line of a memory block string and applying a second voltage level to a second edge word line of the memory block string. Such a method might also include applying a third voltage level to non-edge word lines of the memory block string.

Abstract: One floating gate transistor embodiment includes a first source/drain region, a second source/drain region, and a channel region therebetween. A floating gate is separated from the channel region by a first gate oxide. The floating gate includes oxide-conductor nanolaminate layers to trap charge in potential wells formed by different electron affinities of the oxide-conductor nanolaminate layers.

Abstract: An apparatus and a method for forming the apparatus include a semiconductor layer on an insulating substrate, where the substrate is a different material than the semiconductor layer, and has a coefficient of thermal expansion substantially equal to that of the semiconductor layer. The semiconductor layer can also be formed having a thickness such that it does not yield due to temperature-induced strain at device processing temperatures. A silicon layer bonded to a silicon oxycarbide glass substrate provides a silicon on insulator wafer in which circuitry for electronic devices is fabricated.

Abstract: A method of depositing dielectric material into sub-micron spaces and resultant structures is provided. After a trench is etched in the surface of a wafer, a liner layer preferably is deposited into the trench. An anisotropic plasma process is then performed on the trench. A silicon layer may be deposited on the base of the trench during the plasma process, or the plasma can treat the liner layer. The trench is then filled with a spin-on precursor. A densification or reaction process is then applied to convert the spin-on material into an insulator, and oxidizing the silicon rich layer on the base of the trench. The resulting trench has a consistent etch rate from top to bottom of the trench.

Abstract: Doped aluminum oxide layers having a porous aluminum oxide layer and methods of their fabrication. The porous aluminum oxide layer may be formed by evaporation physical vapor deposition techniques to facilitate formation of a high-purity aluminum oxide layer. A dopant material is embedded in the pores of the porous aluminum oxide layer and subsequently converted to a dielectric form. The degree of porosity of the porous aluminum oxide layer may be controlled during formation to facilitate control of the level of doping of the doped aluminum oxide layer. Such doped aluminum oxide layers are useful as gate dielectric layers, intergate dielectric layers and capacitor dielectric layers in various integrated circuit devices.

Abstract: Doped aluminum oxide layers having a porous aluminum oxide layer and methods of their fabrication. The porous aluminum oxide layer may be formed by evaporation physical vapor deposition techniques to facilitate formation of a high-purity aluminum oxide layer. A dopant material is embedded in the pores of the porous aluminum oxide layer and subsequently converted to a dielectric form. The degree of porosity of the porous aluminum oxide layer may be controlled during formation to facilitate control of the level of doping of the doped aluminum oxide layer. Such doped aluminum oxide layers are useful as gate dielectric layers, intergate dielectric layers and capacitor dielectric layers in various integrated circuit devices.

Abstract: A memory system including a non-volatile flash memory and a method for simultaneously selecting a plurality of memory blocks are disclosed. The memory system is organized into multiple main blocks each having multiple smaller blocks, emulating a disk drive. Control lines activate a number of modes. In a first mode, high-order address lines select only one block, while in a second mode, user-specified multiple blocks are selected. Blocks are selected by loading registers with selection bits or by using some of the address lines directly as selection bits. Each bit specifies one of the blocks, and each bit is independent of the others. The memory system also includes a predecoder and a controller which controls the predecoder and the registers so as to select at least two blocks of memory cells. In a third mode, all of the blocks are selected, and in a fourth mode, all blocks are deselected. Selecting multiple blocks allows simultaneous erasing, writing, and reading of multiple bytes stored in the memory.

Abstract: A preferred exemplary embodiment of the current invention concerns a memory testing process, wherein circuitry is provided on a chip to allow on-chip comparison of stored data and expected data. The on-chip comparison allows the tester to transmit in a parallel manner the expected data to a plurality of chips. In a preferred embodiment, at most one address—and only the column address—corresponding to a failed memory cell is stored in an on-chip register at one time, with each earlier failed addresses being cleared from the register in favor of a subsequent failed address. Another bit—the “fail flag” bit—is stored in the register to indicate that a failure has occurred. If the fail flag is present in a chip, that chip is repaired by electrically associating the column address with redundant memory cells rather than the original memory cells. Subsequently, the chip's register may be cleared and testing may continue.

Abstract: A flash memory device that can detect short circuits in local and global bit lines. The flash memory device has a plurality of sets of adjacent local bit lines, a plurality of global bit lines and a plurality of select transistors. Each select transistor has a control gate and is coupled between one of the local bit lines in each set of local bit lines and one of the global bit lines. Thus, each local bit line in each set of local bit lines is coupled to a different global bit line. Multiple select lines are used to activate the control gates on the select transistors. Each select line is coupled to the control gates on associated select transistors. The associated select transistors are select transistors that are coupled to the local bit lines in an associated set of local bit lines.

Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Abstract: Within an integrated circuit, a contact plug with a height not extending above the level of the gate/wordline nitride is nonetheless provided with a relatively large contact area or landing pad, significantly larger than the source/drain region to which the contact plug is electrically connected. Methods for producing the inventive contact plug include (1) use of a nitride facet etch, either (a) during a nitride spacer formation etch or (b) during a BPSG etch; (2) using at least one of (a) an isotropic photoresist etch or partial descum to narrow BPSG spacers above the gate/wordline nitride, and (b) a nitride step etch to etch the shoulder area of the gate/wordline nitride exposed by a BPSG etch; and (3) polishing a BPSG layer down to the top of a gate/wordline nitride before any doped polysilicon plug fill, masking for BPSG etch and performing a BPSG etch, etching the photoresist layer through a partial descum, and etching the shoulder area of the gate/wordline nitride exposed thereby.

Abstract: A computer implemented method is disclosed for automatically intercepting and analyzing computer modem commands for toll characteristics andthen alternatively permitting or preventing the computer modem command based on the results of the toll analysis and user preferences. The computer modem command is analyzed by extracting any proposed telephone dialing instructions and comparing the proposed telephone number to be dialed with data provided by the local telephone service provider (TSP) in order to determine whether the proposed telephone number would result in a “toll call,” or telephone service charges over and above the usual monthly rate, if transmitted to the modem. If a telephone service charge would result, the computer user is notified and prompted to give further instructions concerning whether the toll call should be placed.

Abstract: Improved methods and structures are provided that allow for the updating of output driver impedances for a circuit to match an impedance of the transmission line to which the circuit is coupled. In particular, improved methods and structures are provided which allow for a reliable updating of the output driver impedance without requiring the output driver to be tristated in order to prevent data loss. Embodiments of a method of forming an integrated circuit include coupling a data line to an enable input of a holding device. The method also includes coupling at least one impedance line to a data input of the holding device. The at least one impedance line carries an impedance update signal. Further, an impedance of the data line at a data output of the memory device is capable of being updated to a value equal to the impedance update signal when the data line is quiescent.

Abstract: An inventive digital delay locked loop (DLL) for outputting at least first and second output clocks includes delay elements for receiving an input clock and outputting a first series of delayed clocks, each lagging the input clock more than its predecessor. A phase detector compares relative phases of the first output clock and the input clock and outputs count-up or count-down control signals in accordance therewith. First and second counters output respective first and second counts in response to the count-up or count-down control signals, and a first multiplexer selects and outputs the first output clock from among the first series of delayed clocks in accordance with the first count. Also, interpolation circuitry receives a portion of the first series of delayed clocks and outputs same, along with a plurality of interpolated clocks, in the form of a second series of delayed clocks, each lagging the input clock more than its predecessor.