Patents Assigned to Micron Technology, Inc., Boise, ID
  • Stacked die in die BGA package
    Publication number: 20030207515
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: April 28, 2003
    Publication date: November 6, 2003
    Applicant: Micron Technology, Inc., Boise, ID
    Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour