Abstract: Apparatuses and methods for fabricating multilayer structures are described. An example method includes: forming a conductive base layer including silicon; forming a first conductive layer including first conductive material above the conductive base layer; forming a conductive barrier layer above the conductive layer; performing thermal loading to form a second conductive layer including silicide of the first conductive material between the conductive base layer and the conductive barrier layer; and forming a third conductive layer above the conductive barrier layer.

Abstract: An apparatus and method for testing a patient for distinguishing symptoms of a heart attack and GERD. A saliva specimen holder is configured to collect a saliva sample. A blood specimen holder with a well configured to collect a blood sample, a D-dimer testing zone, and a membrane in fluid communication with the well and the D-dimer testing zone. The membrane is configured to fluidly communicate a blood sample to the D-dimer testing zone. A composition on the membrane in the D-dimer testing zone is configured, when mixed with blood containing a D-dimer protein, to provide an indicator. A processor is programmed to analyze the collected blood sample to determine whether a D-dimer protein is detected in the blood sample and to analyze the saliva sample and to send information to the display indicating whether or not pepsin was detected.

Abstract: A transistor comprises a pair of source/drain regions having a channel region there-between. A gate is adjacent the channel region with a gate insulator being between the gate and the channel region. A fixed-charge material is adjacent the source/drain regions. Insulating material is between the fixed-charge material and the source/drain regions. The insulating material and the fixed-charge material comprise different compositions relative one another. The fixed-charge material has charge density of at least 1 x 1011 charges/cm2.

Abstract: An exemplary semiconductor device includes an internal clock circuit configured to intermittently enable and disable a clock signal while in a Maximum Power Savings Mode. The duty cycle of the enablement and disablement of the clock signal may be based on susceptibility to negative-bias temperature instability of a component of the semiconductor device. The clock signal may be enabled and disabled via a synchronizer.

Abstract: Apparatuses and methods for row hammer counter mat. A memory array may have a number of memory mats and a counter memory mat. The counter mat stores count values, each of which is associated with a row in one of the other memory mats. When a row is accessed, the count value is read out, changed, and written back to the counter mat. In some embodiments, the count value may be processed within access logic of the counter mat, and a row hammer flag may be provided to the bank logic. In some embodiments, the counter mat may have a folded architecture where each sense amplifier is coupled to multiple bit lines in the counter mat. The count value may be used to determine if the accessed row is an aggressor so that its victims can be refreshed as part of a targeted refresh.

Abstract: Some embodiments include an integrated assembly with a semiconductor channel material having a boundary region where a more-heavily-doped region interfaces with a less-heavily-doped region. The more-heavily-doped region and the less-heavily-doped region have the same majority carriers. The integrated assembly includes a gating structure adjacent the semiconductor channel material and having a gating region and an interconnecting region of a common and continuous material. The gating region has a length extending along a segment of the more-heavily-doped region, a segment of the less-heavily-doped region, and the boundary region. The interconnecting region extends laterally outward from the gating region on a side opposite the semiconductor channel region, and is narrower than the length of the gating region. Some embodiments include methods of forming integrated assemblies.

Abstract: In some embodiments, a memory array comprising strings of memory cells comprise laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Insulative pillars are laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The pillars comprise vertically-spaced and radially-projecting insulative rings in the conductive tiers as compared to the insulative tiers. Other embodiments, including methods, are disclosed.

Abstract: Memory circuitry comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers in a memory-array region. The insulative tiers and the conductive tiers of the laterally-spaced memory blocks extend from the memory-array region into a stair-step region. Individual stairs in the stair-step region comprise one of the conductive tiers. Conductive vias are individually directly against conducting material that is in the one conductive tier in one of the individual stairs. Insulator material in the stair-step region is directly above the stairs. An insulative-material lining is circumferentially around and extends elevationally along individual of the conductive vias between the individual conductive vias and the insulator material.

Abstract: Components of sense amplifiers may share contacts that couple the components to a global line via a local line. In some examples, the components may be pull-down circuits of a same sense amplifier or pull-down circuits of adjacent sense amplifiers. The shared contact may include a transistor or a resistance between the local line and the global line. In some examples, the global line may be an RNL line. The transistor or resistance may reduce the impact of voltage across the components from affecting the global line and/or reduce the impact of voltage changes on the global line on the individual components.

Abstract: Apparatuses and methods for row hammer counter mat. A memory array may have a number of memory mats and a counter memory mat. The counter mat stores count values, each of which is associated with a row in one of the other memory mats. When a row is accessed, the count value is read out, changed, and written back to the counter mat. In some embodiments, the count value may be processed within access logic of the counter mat, and a row hammer flag may be provided to the bank logic. In some embodiments, the counter mat may have a folded architecture where each sense amplifier is coupled to multiple bit lines in the counter mat. The count value may be used to determine if the accessed row is an aggressor so that its victims can be refreshed as part of a targeted refresh.

Abstract: Disclosed herein is an apparatus that includes a first wiring layer including first and second conductive patterns extending in a second direction and coupled to source and drain regions, respectively, and a second wiring layer including third and fourth conductive patterns extending in the second direction and coupled to the first and second conductive patterns, respectively. The first conductive pattern has first and second sections arranged in the second direction, and the second conductive pattern has third and fourth sections arranged in the second direction. The first and fourth sections are arranged in a first direction, and the second and third sections are arranged in the first direction. The third conductive pattern covers the first section without covering the second section. The fourth conductive pattern covers the third section without covering the fourth section.

Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Channel-material strings extend through the insulative tiers and the conductive tiers. Horizontally-elongated trenches are between immediately-laterally-adjacent of the memory blocks. Conductor material is in and extends elevationally along sidewalls of the trenches laterally-over the conductive tiers and the insulative tiers and directly electrically couples together conducting material of individual of the conductive tiers. The conductor material is exposed to oxidizing conditions to form an insulative oxide laterally-through the conductor material laterally-over individual of the insulative tiers to separate the conducting material of the individual conductive tiers from being directly electrically coupled together by the conductor material. Additional embodiments are disclosed.

Abstract: Examples described herein include methods, devices, and systems which may compensate input data for nonlinear power amplifier noise to generate compensated input data. In compensating the noise, during an uplink transmission time interval (TTI), a switch path is activated to provide amplified input data to a receiver stage including a recurrent neural network (RNN). The RNN may calculate an error representative of the noise based partly on the input signal to be transmitted and a feedback signal to generate filter coefficient data associated with the power amplifier noise. The feedback signal is provided, after processing through the receiver, to the RNN. During an uplink TTI, the amplified input data may also be transmitted as the RF wireless transmission via an RF antenna. During a downlink TTI, the switch path may be deactivated and the receiver stage may receive an additional RF wireless transmission to be processed in the receiver stage.

Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple to conductor material of the conductor tier. A through-array-via (TAV) region comprises TAVs that individually extend through a lowest of the conductive tiers. Insulative rings are in the lowest conductive tier in the TAV region. Individual of the insulative rings encircle individual of the TAVs. The insulative rings extend through the lowest conductive tier and into the conductor tier. Outer rings are in the lowest conductive tier that individually encircle one of the individual insulative rings that encircle the individual TAVs. Other embodiments, including method, are disclosed.

Abstract: Some embodiments include an integrated assembly having digit lines supported by a base and extending along a first direction. A shield-connection-line is supported by the base and extends along the first direction. Transistor active regions are over the digit lines. Each of the active regions includes a channel region between an upper source/drain region and a lower source/drain region. The lower source/drain regions are coupled with the digit lines. Capacitors are coupled with the upper source/drain regions. Wordlines extend along a second direction which crosses the first direction. The wordlines include gate regions adjacent the channel regions. Shield lines extend along the second direction. The shield lines are above the digit lines and are coupled with the shield-connection-line.

Abstract: Examples of systems and method described herein provide for the processing of image codes (e.g., a binary embedding) at a memory system including a Hamming processing unit. Such images codes may generated by various endpoint computing devices, such as Internet of Things (IoT) computing devices, Such devices can generate a Hamming processing request, having an image code of the image, to compare that representation of the image to other images (e.g., in an image dataset) to identify a match or a set of neural network results. Advantageously, examples described herein may be used in neural networks to facilitate the processing of datasets, so as to increase the rate and amount of processing of such datasets. For example, comparisons of image codes can be performed “closer” to the memory devices, e.g., at a processing unit having memory devices.

Abstract: An example method may be used to perform concurrent compensation in a memory array. The example method may include decoding a prime row address corresponding to a respective prime memory cell row of a first row section of a memory array mat to provide a prime section signal, and in response to a determination that the prime row address matches a defective prime row address, providing a redundant section signal corresponding to a respective redundant memory cell row of a second row section of the memory array mat. In response to the prime section signal, initiating a first threshold voltage compensation operation on first sensing circuitry coupled to the first row section; and in response to the redundant section signal indicating a defective prime row, initiating a second threshold voltage compensation operation on second sensing circuitry coupled to the second row section concurrent with the first threshold voltage compensation operation.

Abstract: Examples described herein utilize multi-layer neural networks to decode encoded data (e.g., data encoded using one or more encoding techniques). The neural networks may have nonlinear mapping and distributed processing capabilities which may be advantageous in many systems employing the neural network decoders. In this manner, neural networks described herein may be used to implement error code correction (ECC) decoders.

Abstract: An allergy test kit including a housing, a biosensor supported by the housing, the biosensor operable to detect a presence of immunoglobin A (IgA) in a sample of sweat of a user and to generate IgA presence data, an allergen sensor supported by the housing, the allergen sensor operable to detect a presence of an allergen in a substance sample provided by the user and to generate allergen presence data, a processor operable to receive the IgA presence data from the biosensor and the allergen presence data from the allergen sensor, and a memory operable to store the IgA presence data and the allergen presence data.

Abstract: Apparatuses, systems, and methods for data timing alignment in stacked memory. The memory a number of core dice stacked on an interface die. The core and interface die each include adjustable delay circuits along each of a delay and native path. A state machine operates interface and core aligner control circuits to set values of the delay(s) in the interface and core dice respectively. The state machine may initialize the delays and then enter a maintenance state where averaging is used to determine when to adjust the delay in the core dice. If an overflow or underflow condition is met, the state machine may cycle between adjusting the delay in the interface die and adjusting the delays in the core dice without averaging until the overflow and underflow conditions are no longer met and the maintenance state is returned to.