Abstract: A memory array contains a plurality of banks coupled to each other by a plurality of data lines. Each of the data lines is divided into a plurality of segments within the array. Respective bidirectional buffers couple read data from one of the segments to another in a first direction, and to couple write data from one of the segments to another in a second direction that is opposite the first direction. The data lines may be local data read/write lines that couple different banks of memory cells to each other and to respective data terminals, digit lines that couple memory cells in a respective column to respective sense amplifiers, word lines that activate memory cells in a respective row, or some other signal line within the array. The memory array also includes precharge circuits for precharging the segments of respective data lines to a precharge voltage.

Abstract: Some embodiments provide a method to reduce the refresh power consumption by effectively extending the memory cell retention time. Conversion from 1 cell/bit to 2N cells/bit reduces the variation in the retention time among memory cells. Although active power increases by a factor of 2N, the refresh time increases by more than 2N as a consequence of the fact that the majority decision does better than averaging for the tail distribution of retention time. The conversion can be realized very simply from the structure of the DRAM array circuit, and it reduces the frequency of disturbance and power consumption by two orders of magnitude. On the basis of this conversion method, some embodiments provide a partial access mode to reduce power consumption dynamically when the full memory capacity is not required.

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

Abstract: A memory device includes a memory array that includes a buffer data. The memory device also includes a memory controller. The memory controller includes an error correction code (ECC) component. The memory controller further receives a status command and an indication related to the quality of the data to analyze with the ECC component. Based on a status value, the memory controller utilizes one of a plurality of error correction techniques via the ECC component to correct an error (e.g., soft state, calibration, etc.).

Abstract: Memory cell architectures and methods of forming the same are provided. An example memory cell can include a switch element and a memory element formed in series with the switch element. A smallest lateral dimension of the switch element is different than a smallest lateral dimension of the memory element.

Abstract: A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.

Abstract: Methods, systems and devices are disclosed, such as an electronic device that includes a plurality of data locations and a delta-sigma modulator. In some embodiments, the delta-sigma modulator includes a preamplifier coupled to the data locations and a latch coupled to the preamplifier.

Abstract: Devices and systems for powering up a memory device, for example, are disclosed. One such memory device includes power up circuitry configured to receive an external power supply and to provide an internal power supply to the memory device upon receipt of a command. The power up circuitry may be configured to provide the internal power supply limited to a peak current, or may be configured to provide the internal power supply not limited to a peak current. The memory device may be, for example, a synchronous dynamic random access memory (SDRAM) device or Flash memory.

Abstract: Embodiments are provided that include a circuit for generating voltage in a memory. One such circuit includes a charge pump circuit including a first transistor, a high-voltage switch circuit, and a cut-off switch circuit arranged to reduce leakage current from the charge pump circuit. The cut-off switch circuit includes a second transistor, wherein an output of the charge pump circuit is coupled to one of a source node and a drain node of the second transistor, and a first control signal is input at a gate of the second transistor. Further embodiments provide a method for generating voltage. One such method includes enabling a first transistor coupled to an output of a charge pump circuit when the charge pump is operating and disabling the first transistor coupled to the output of the charge pump circuit when the charge pump circuit is not operating.

Abstract: Disclosed are methods and devices, among which is a device that includes a pattern-recognition processor. The pattern-recognition processor may include or be coupled to a results buffer, which may have a plurality of records, a write-control module configured to write data relevant to search results in the plurality of records, and a read control module configured to read data from the plurality of records.

Abstract: Memories and methods of operating memories having memory cells sharing a resistance variable material.

Abstract: Sense circuits, memory devices, and related methods are disclosed. A sense circuit includes sample and hold circuitry configured to sample and hold a second response voltage potential, a first response voltage potential, and a third response voltage potential responsive to an evaluation signal applied to a resistance variable memory cell. The sense circuit includes an amplifier operably coupled to the sample and hold circuitry. The amplifier is configured to amplify a difference between a sum of the first response voltage potential and the third response voltage potential, and twice the second response voltage potential. A memory device includes an evaluation signal generating circuit configured to provide the evaluation signal, an array of resistance variable memory cells, and the sense circuit. A method includes applying the evaluation signal to the resistance variable memory cell, sampling and holding the response voltage potentials, and discharging the sample and hold circuitry to the amplifier.

Abstract: Some embodiments include a construction having a second semiconductor material over a first semiconductor material. A region of the second semiconductor material proximate the first semiconductor material has strain due to different lattice characteristics of the first and second semiconductor materials. A transistor gate extends downwardly into the second semiconductor material. Gate dielectric material is along sidewalls and a bottom of the transistor gate. Source/drain regions are along the sidewalls of the transistor gate, and the gate dielectric material is between the source/drain regions and the transistor gate. A channel region extends between the source/drain regions and is under the bottom of the transistor gate. At least some of the channel region is within the strained region.

Abstract: Memory devices having a first plurality of data buffers coupled to sense circuitry, a second plurality of data buffers coupled to sense circuitry, and an error correction controller coupled to the first and second plurality of data buffers and configured to synchronize data from the first and second plurality of data buffers prior to transmitting the data, as well as systems containing such memory devices.

Abstract: Memory devices are shown that include a body region and a connecting region that is formed from a semiconductor with a lower band gap than the body region. Connecting region configurations can provide increased gate induced drain leakage during an erase operation. Configurations shown can provide a reliable bias to a body region for memory operations such as erasing, and containment of charge in the body region during a boost operation.

Abstract: A low-dropout regulator includes an error amplifier to provide a control signal, a first transistor, and a second transistor. The first transistor receives the control signal and has a source-drain path electrically coupled between a supply voltage node and a load, the first transistor to power the load in response to a voltage on the supply voltage node rising above an absolute value of a threshold voltage of the first transistor. The second transistor has a source-drain path electrically coupled between the supply voltage node and the load, the second transistor to receive the control signal in response to the voltage on the supply voltage node rising above a particular voltage.

Abstract: A device with error correction is provided. The device includes a plurality of memory cells, and reference read write circuit, a plurality of sense amplifiers, and an error-correction code control block. The reference read write circuit is configured to generate a reference voltage in response to data stored in at least one of the plurality of memory cells. A plurality of sense amplifiers are each coupled to a respective memory cell of the plurality of memory cells. An error-correction code (ECC) control block may output an error signal when the ECC control block detects that it is unable to correct error data in one or more respective memory cells. The reference read write circuit may overwrite data in the at least one of the plurality of memory cells in response to the error signal.

Abstract: In an embodiment of a memory device including a matrix of memory cells wherein the memory cells are arranged in a plurality of memory cells strings each one including at least two serially-connected memory cells, groups of at least two memory cells strings being connected to a respective bit line, and wherein said memory cells are adapted to be programmed into at least a first programming state and a second programming state, a method of storing data comprising exploiting a single memory cell for each of the memory cells string for writing the data, wherein said exploiting includes bringing the single memory cell to the second programming state, the remaining memory cells of the string being left in the first programming state.

Abstract: Embodiments of methods and memory devices for performing the methods are disclosed. In an embodiment, one such method includes programming all memory cells that are to be respectively programmed to different levels other than a lowest level, corresponding to a lowest data state, to an intermediate level from the lowest level and respectively programming all the memory cells that are to be respectively programmed to the different levels other than the lowest level to the different levels other than the lowest level from the intermediate level.

Abstract: Disclosed technology relates generally to integrated circuits, and more particularly, to structures incorporating and methods of forming metal lines including tungsten and carbon, such as conductive lines for memory arrays. In one aspect, a memory device comprises a lower conductive line extending in a first direction and an upper conductive line extending in a second direction and crossing the lower conductive line, wherein at least one of the upper and lower conductive lines comprises tungsten and carbon. The memory device additionally comprises a memory cell stack interposed at an intersection between the upper and lower conductive lines. The memory cell stack includes a first active element over the lower conductive line and a second active element over the first active element, wherein one of the first and second active elements comprises a storage element and the other of the first and second active elements comprises a selector element.