Patents Assigned to Micron Technology, Incv.
  • Die architecture accommodating high-speed semiconductor devices
    Patent number: 6314012
    Abstract: In a semiconductor memory device, a die architecture is provided that arranges memory arrays into a long, narrow configuration. Bond pads may then be placed along a long side of a correspondingly shaped die. As a result, this architecture is compatible with short lead frame “fingers” for use with wide data busses as part of high speed, multiple band memory integrated circuits.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: November 6, 2001
    Assignee: Micron Technology, Incv.
    Inventors: Donald M. Morgan, Todd A. Merritt