Patents Assigned to Micron Technology, Ing.
  • Patent number: 7332401
    Abstract: An electrode structure includes a first layer of conductive material and a dielectric layer formed on a surface of the first layer. An opening is formed in the dielectric layer to expose a portion of the surface of the first layer. A binding layer is formed on the dielectric layer and on the exposed portion of the surface of the first layer and a second layer of conductive material is formed on the conductive binding layer. The binding layer can be an oxide and the second layer a conductive material that is diffusible into an oxide. The electrode structure can be annealed to cause conductive material from the second layer to be chemisorbed into the binding layer to improve adhesion between the first and second layers. A programmable cell can be formed by forming a doped glass layer in the electrode structure.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: February 19, 2008
    Assignee: Micron Technology, Ing.
    Inventors: John T. Moore, Joseph F. Brooks
  • Patent number: 6734510
    Abstract: This invention relates to a process of forming a transistor with three vertical gate electrodes and the resulting transistor. By forming such a transistor it is possible to maintain an acceptable aspect ratio as MOSFET structures are scaled down to sub-micron sizes. The transistor gate electrodes can be formed of different materials so that the workfunctions of the three electrodes can be tailored. The three electrodes are positioned over a single channel and operate as a single gate having outer and inner gate regions.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: May 11, 2004
    Assignee: Micron Technology, Ing.
    Inventors: Leonard Forbes, Luan C. Tran, Kie Y. Ahn