Abstract: A mask loading apparatus and method employing a cassette (200) detachably mounted on an in-out cassette holder (212). The cassette is made of low Z-materials, and comprises a cover (211) and a bottom mask-supporting tray (202) locked by machine-operable locking members (224) to the cover. A lift cylinder (218) has a vacuum cup (216) which is raised to support and hold the underside (213) of the tray and, when the tray is unlocked from the cover, to move the vacuum cup, tray and mask downwardly and then laterally by a transport arm (203) to a fixed location under a mask holder (205, 220) in a lithographic apparatus.The lift cylinder then raises the cup, tray and mask to abut the mask holder and to transfer the mask to the mask holder. The lift cylinder and empty tray is then lowered and removed from a position blocking the mask as it is to be used in the lithography processing. A reversal of the sequence of steps is utilized to unload the mask from its use mode and return it to its cassette cover.

Abstract: A mask aligner (10) includes a ring member (11) having an aperture (13) and a series of internal pneumatic cylinders (14-17) having rolling bearing surfaces (19) at the ends of piston rod shafts (18) wherein when a mask (20) is positioned in the aperture, one bearing surface is actuated inwardly to move the mask laterally into engagement with others of said bearing surfaces to rigidly hold and coarse align the mask. Fine accurate alignment in the x, y and .phi. directions are provided by a spaced series of linear motors (40, 41, 42) and a linkage (45) extending between the motor shaft (43) and a rigid post on a fixed support arm (12), the linkage being of sufficient flexibility to bend when the linear motor moves its shaft (43) inwardly to shorten the span between the motor(s) and the rigid post, and of sufficient stiffness to act as a push rod when the linear motor moves its shaft outwardly to lengthen the span between the motor(s) and the rigid post.

Abstract: An adjusting means for a microscope objection (51a) or the like is provided comprising a fixed support (53), a piezomotor (52) having an output ram (54) capable of accurate incremental movement and which is adapted to strike a flexible leg or lever (55) which amplifies the incremental ram movement. The cantilevered end (57) of leg (55) moves arcuately to strike a second oppositely extending lever (60) which is journalled in a flexure pivot (61). Lever (60) extends back toward the objective (50a) and further accurately amplifies the incremental ram movement so as to move the objective a finite distance based on electrical inputs to the piezomotor.

Abstract: Alignment apparatus particularly for a semiconductor wafer (140) includes a horizontal support plate (134), a horizontal rotatable theta plate (106) below the support plate and a horizontal x-y motion plate below the rotatable plate. Three piezoelectric linear drive motors (128-130) are mounted depending from the rotatable plate and having linear shafts (128a, etc.) extending thereabove to support the support plate, drive the support in the z-axis and then differentially operated to tilt the support plate. A pair of linear piezoelectric motors (110,115) drive the motion plate in x- and y-directions. A theta drive linear piezoelectric motor (137) functions to rotate the theta plate (106). Flexure connections (113, 117, 119, 121, 138, 144) are provided between the various motors and plates. Mask registration means (124, 125) extends upwardly past the edges of the plates to initially gap the wafer-to-mask distance.

Abstract: In an x-ray source having a cathode emitting electron beams (15, 16) bombarding inner surfaces of an inverted conical anode target cooled by flowing water on its exterior, providing in place of the apex (14b) of the conical anode (34) a rearwardly facing upstream cylindrical extension (34b) which insures against apex tip burn-out by extending the cooling structure, area and mass to an upstream position to further dissipate heat energy flux generated by impingement of the electron beam. Portions functioning to effectively cool the anode target extend into non-beam illuminating regions of the target anode.

Abstract: A lithography system for X-ray or other beam printing on a substrate such as a silicon semiconductor wafer comprises a beam chamber (301), a beam source (302), means (309) for mounting a mask, means (308) for mounting an image sensing means (342) interiorly of the chamber, means (317, 318), for mounting a substrate (307) in multiple including six degrees of freedom and means (308, 292, 320-322) including the image sensing means to align the mask and substrate relative to one another utilizing alignment patterns on the mask and substrate, images of which are brought into registration and sensed by the image sensing means. In a preferred embodiment three sets of target images are provided so as to adjust the substrate and mask relative orientation in six degrees of freedom. The mask seals helium within the chamber. The mask and the substrate are aligned in situ in the same position in which the mask and substrate are to be exposed to the beam.

Abstract: A lithography system for X-ray or other beam printing on a substrate such as a silicon semiconductor wafer comprises a beam chamber (301), a beam source (302), means (309) for mounting a mask, means (308) for mounting an image sensing means (342) interiorly of the chamber, means (317, 318), for mounting a substrate (307) in multiple including six degrees of freedom and means (308, 292, 320-322) including the image sensing means to align the mask and substrate relative to one another utilizing alignment patterns on the mask and substrate, images of which are brought into registration and sensed by the image sensing means. In a preferred embodiment three sets of target images are provided so as to adjust the substrate and mask relative orientation in six degrees of freedom. The mask seals helium within the chamber. The mask and the substrate are aligned in situ in the same position in which the mask and substrate are to be exposed to the beam.