Patents Assigned to Microns Technology, Inc.
  • Patent number: 10903218
    Abstract: Some embodiments include an integrated assembly having first electrodes with top surfaces, and with sidewall surfaces extending downwardly from the top surfaces. The first electrodes are solid pillars. Insulative material is along the sidewall surfaces of the first electrodes. Second electrodes extend along the sidewall surfaces of the first electrodes and are spaced from the sidewall surfaces by the insulative material. Conductive-plate-material extends across the first and second electrodes, and couples the second electrodes to one another. Leaker-devices electrically couple the first electrodes to the conductive-plate-material and are configured to discharge at least a portion of excess charge from the first electrodes to the conductive-plate-material. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Alessandro Calderoni, Beth R. Cook, Durai Vishak Nirmal Ramaswamy, Ashonita A. Chavan
  • Patent number: 10901862
    Abstract: A memory system includes a processing device (e.g., a controller implemented using a CPU, FPGA, and/or logic circuitry) and memory regions (e.g., in a flash memory or other non-volatile memory) storing data. The processing device receives an access request from a host system that is requesting to read the stored data. In one approach, the memory system is configured to: receive, from the host system over a bus, a read command to access data associated with an address in a non-volatile memory; in response to receiving the read command, access, by the processing device, multiple copies of data stored in at least one memory region of the non-volatile memory; match, by the processing device, data from the copies with each other; select, based on matching data from the copies with each other, first data from a first copy of the copies; and provide, to the host system over the bus, the first data as output data.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Gil Golov
  • Patent number: 10903223
    Abstract: A memory can have a stacked memory array that can have a plurality of levels of memory cells. Each respective level of memory cells can be commonly coupled to a respective access line. A plurality of drivers can be above the stacked memory array. Each respective driver can have a monocrystalline semiconductor with a conductive region coupled to a respective access line.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Haitao Liu, Kamal M. Karda, Gurtej S. Sandhu, Sanh D. Tang, Akira Goda, Lifang Xu
  • Patent number: 10901903
    Abstract: Devices and techniques are disclosed herein for implementing, in addition to a first cache, a second, persistent cache in a memory system coupled to a host. The memory system can include flash memory. In certain examples, the first cache and the second cache are configured to store mapping information. In some examples, the mapping information of the second persistent cache is determined by the host using a persistence flag of memory requests provided to the memory system.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Nadav Grosz
  • Patent number: 10902906
    Abstract: Apparatuses and methods are provided for logic/memory devices. An example apparatus comprises a plurality of memory components adjacent to and coupled to one another. A logic component is coupled to the plurality of memory components. At least one memory component comprises a memory device having an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry includes a sense amplifier and a compute component. Timing circuitry is coupled to the array and sensing circuitry and configured to control timing of operations for the sensing circuitry. The logic component comprises control logic coupled to the timing circuitry. The control logic is configured to execute instructions to cause the sensing circuitry to perform the operations.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Richard C. Murphy
  • Patent number: 10903860
    Abstract: Apparatuses and methods for performing an error correction code (ECC) operation are provided. One example method can include encoding data by including parity data for a number of cross-over bits, wherein the number of cross-over bits are bits located at intersections of column codewords and row codewords.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Patrick R. Khayat, Sivagnanam Parthasarathy, Mustafa N. Kaynak
  • Patent number: 10903221
    Abstract: Some embodiments include a memory cell having a conductive gate, and having a charge-blocking region adjacent the conductive gate. The charge-blocking region includes silicon oxynitride and silicon dioxide. A charge-storage region is adjacent the charge-blocking region. Tunneling material is adjacent the charge-storage region. Channel material is adjacent the tunneling material. The tunneling material is between the channel material and the charge-storage region. Some embodiments include memory arrays. Some embodiments include methods of forming assemblies (e.g., memory arrays).
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Changhan Kim
  • Patent number: 10901694
    Abstract: An arithmetic logic unit (ALU) including a binary, parallel adder and multiplier to perform arithmetic operations is described. The ALU includes an adder circuit coupled to a multiplexer to receive input operands that are directed to either an addition operation or a multiplication operation. During the multiplication operation, the ALU is configured to determine partial product operands based on first and second operands and provide the partial product operands to the adder circuit via the multiplexer, and the adder circuit is configured to provide an output having a value equal to a product of the first operand second operands. During an addition operation, the ALU is configured to provide the first and second operands to the adder circuit via the multiplexer, and the adder circuit is configured to provide the output having a value equal to a sum of the first and second operands.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Fabio Indelicato
  • Patent number: 10902901
    Abstract: Methods, systems, and devices for access line management for an array of memory cells are described. Some memory devices may include a plate that is coupled with memory cells associated with a plurality of digit lines and/or a plurality of word lines. Because the plate is coupled with a plurality of digit lines and/or word lines, unintended cross-coupling between various components of the memory device may be significant. To mitigate the impact of unintended cross-coupling between various components, the memory device may float unselected word lines during one or more portions of an access operation. Accordingly, a voltage of each unselected word line may relate to the voltage of the plate as changes in plate voltage may occur.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Daniele Vimercati
  • Patent number: 10903276
    Abstract: The disclosed technology relates to integrate circuits, including memory devices. A method of forming an integrated circuit comprises providing a surface comprising a first region and a second region, wherein the first region is formed of a different material than the second region. The method additionally comprises forming a seeding material in contact with and across the first and second regions. The method further comprises forming a metal comprising tungsten on the seeding material.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Tsz Wah Chan, Yongjun J. Hu, Swapnil Lengade
  • Patent number: 10901734
    Abstract: Apparatuses and methods related to commands to transfer data and/or perform logic operations are described. For example, a command that identifies a location of data and a target for transferring the data may be issued to a memory device. Or a command that identifies a location of data and one or more logic operations to be performed on that data may be issued to a memory device. A memory module may include different memory arrays (e.g., different technology types), and a command may identify data to be transferred between arrays or between controllers for the arrays. Commands may include targets for data expressed in or indicative of channels associated with the arrays, and data may be transferred between channels or between memory devices that share a channel, or both. Some commands may identify data, a target for the data, and a logic operation for the data.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Frank F. Ross, Matthew A. Prather
  • Patent number: 10903220
    Abstract: Some embodiments include an assembly having channel material structures extending upwardly from a conductive structure. Anchor structures are laterally offset from the channel material structures and penetrate into the conductive structure to a depth sufficient to provide mechanical stability to at least a portion of the assembly. The conductive structure may include a first conductive material over a second conductive material, and may be a source line of a three-dimensional NAND configuration. Some embodiments include methods of forming assemblies to have channel material structures and anchor structures.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Kunal R. Parekh, Justin B. Dorhout, Nancy M. Lomeli
  • Patent number: 10902935
    Abstract: Methods, systems, and devices related to access schemes for access line faults in a memory device are described. In one example, a method may include isolating a first word line of a section of a memory device from a voltage source (e.g., a deselection voltage source) during a first portion of a period when the first word line is deselected, and coupling the first word line with the voltage source during a second portion of the period when the first word line is deselected based on determining that an access operation is performed during the second portion of the period when the word line is deselected. In some examples, the method may include identifying that the first word line is associated with a fault, such as a short circuit fault with a digit line of the memory device.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Yasushi Matsubara
  • Patent number: 10902892
    Abstract: Disclosed herein is an apparatus that includes first and second signal lines; a first differential amplifier having an inverting input node receiving an input signal, a non-inverting input node receiving a reference potential, and an output node connected to the first signal line; a second differential amplifier having an inverting input node receiving the reference potential, a non-inverting input node receiving the input signal, and an output node connected to the second signal line; a level shift circuit cross-coupled to the first and second signal lines; a first replica circuit connected to the first signal line; a second replica circuit connected to the second signal line; and a first switch circuit configured to activate one of the level shift circuit, the first replica circuit, and the second replica circuit.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Shuichi Tsukada
  • Patent number: 10901837
    Abstract: The present disclosure includes apparatuses and methods for ECC operation associated with memory. One example apparatus comprises a controller configured to perform an error correction code (ECC) operation on a codeword stored in the memory, wherein the codeword includes a first number of ECC bits and the first number of ECC bits are generated based on an encoding matrix, wherein each row of the encoding matrix has an odd number of bits having a binary value of 1.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Gerard A. Kreifels
  • Patent number: 10902927
    Abstract: Apparatus and methods are provided, such as a method that includes precharging channel material of a string of memory cells in an unselected sub-block of a block of memory cells to a precharge voltage during a first portion of a programming operation. A programming voltage can then be applied to a selected memory cell in a selected sub-block of the block of memory cells during a second portion of the programming operation. The selected memory cell is coupled to a same access line as an unselected memory cell in the unselected sub-block. Additional methods and apparatus are provided.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Aaron Yip
  • Patent number: 10902920
    Abstract: Method of operating an integrated circuit device might include applying a first voltage level to a first conductor while applying a second voltage level to a second conductor, applying a third voltage level to the first conductor while applying a fourth voltage level to the second conductor, and applying a fifth voltage level to the first conductor while applying the second voltage level to the second conductor. The second voltage level might correspond to a target voltage level for the second conductor. A difference between the third voltage level and the first voltage level might have a polarity opposite the polarity of a difference between the fourth voltage level and the second voltage level, and the same polarity of a difference between the fifth voltage level and the first voltage level. The fifth voltage level might correspond to a target voltage level for the first conductor.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Michele Piccardi, Xiaojiang Guo
  • Patent number: 10901658
    Abstract: Devices and techniques for host adaptive memory device optimization are provided. A memory device can maintain a host model of interactions with a host. A set of commands from the host can be evaluated to create a profile of the set of commands. The profile can be compared to the host model to determine an inconsistency between the profile and the host model. An operation of the memory device can then be modified based on the inconsistency.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Nadav Grosz, David Aaron Palmer
  • Patent number: 10902929
    Abstract: Methods, systems, and devices related to zone swapping for wear leveling memory are described. A memory device can perform access operations by mapping respective logical zones associated with respective logical addresses (e.g., of an access command) to respective zones of the memory device. As the memory device receives access commands and accesses respective zones, some zones may undergo a disproportionate amount of access operations relative to other zones. Accordingly, the memory device may swap data stored in some disproportionately accessed zones. The memory device can update a correspondence of respective logical zones associated with the zones based on swapping the data so that later access operations access the desired data.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Joseph T. Pawlowski
  • Patent number: 10904052
    Abstract: Methods, systems, and devices for multiplexing distinct signals on a single pin of a memory device are described. Techniques are described herein to multiplex data using a modulation scheme having at least three levels. The modulated data may be communicated to multiple memory dies over a shared bus. Each of the dies may include a same or different type of memory cell and, in some examples, a multi-level signaling scheme may be pulse amplitude modulation (PAM). Each unique symbol of the modulated signal may be configured to represent a plurality of bits of data.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: January 26, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Robert Nasry Hasbun, Timothy M. Hollis, Jeffrey P. Wright, Dean D. Gans