Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
Type:
Grant
Filed:
May 19, 2011
Date of Patent:
July 16, 2013
Assignees:
Optopac Co., Ltd., Korea Advanced Institute of Science and Technology, Micropack Co., Ltd.
Inventors:
Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
Type:
Application
Filed:
March 29, 2011
Publication date:
September 13, 2012
Applicants:
OPTOPAC CO., LTD, MICROPACK CO., LTD, Korea Advanced Institute of Science and Technology
Inventors:
Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
Type:
Application
Filed:
May 19, 2011
Publication date:
September 13, 2012
Applicants:
OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventors:
Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM
Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
Type:
Application
Filed:
May 19, 2011
Publication date:
September 13, 2012
Applicants:
OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventors:
Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM