Patents Assigned to MICROPACK CO., LTD
  • Patent number: 8486318
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: July 16, 2013
    Assignees: Optopac Co., Ltd., Korea Advanced Institute of Science and Technology, Micropack Co., Ltd.
    Inventors: Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
  • Publication number: 20120231689
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Application
    Filed: March 29, 2011
    Publication date: September 13, 2012
    Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, Korea Advanced Institute of Science and Technology
    Inventors: Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
  • Publication number: 20120231260
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Application
    Filed: May 19, 2011
    Publication date: September 13, 2012
    Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM
  • Publication number: 20120228805
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Application
    Filed: May 19, 2011
    Publication date: September 13, 2012
    Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM