Abstract: Liquid components are separated from a liquid using separation devices, such as filters and membranes, in which capillary forces, which retain the liquid component to be separated in the separation device, are effective. If the amount of liquid is very small, it can be very difficult to remove the liquid component to be separated in the separation device in a free and unchanged form. This process step is simplified or facilitated by a wedge-shaped cut-out at an exit end of the capillary or in a columnar body which is in contact with an exit end of the capillary. A radius of curvature of a wedge edge is smaller than a radius of the capillary. A base side of the wedge-shaped cut-out is adjacent to a collecting chamber in which the separated-off liquid component is collected, and in which the capillary forces are smaller than interfering forces in the capillary itself.

Abstract: A method for manufacturing a microstructured body, comprises irradiating a material with a pattern of X-rays; and dissolving selectively irradiated or non-irradiated regions of the material, where the material comprises a light-hardening and/or UV-hardening epoxy coating. The epoxy coatings need shorter irrdiation times than known plastics. The resulting microstructures can have high aspect ratios, and the developed structures can be produced with greater structure depths, free of defects and faults. Structural precision is in the submicron range.

Abstract: Patterned dies made of non-conductive resins may be equipped with integrated electrodes in different manners. It is proved to be difficult to produce high-quality electrodes especially in microstructured dies. A patterned plastic die arranged on a carrier plate is filled with a solution of a metal compound. This solution is irradiated through the carrier plate from the back side of the carrier plate using laser light, ultraviolet light or X-rays. The metal compound is transformed in the immediate vicinity of the base of the structure and a metal layer is deposited on the base of the structure forming the electrodes. The method is suitable for a base of the structure forming a coherent or a non-coherent area. Plastic dies containing integrated electrodes are used for electroless or electrophoretic deposition of materials and for electroplating, in all cases starting from the integrated electrodes, and for analytical methods.