Patents Assigned to Micropower Global Limited
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Patent number: 11903314Abstract: An induction heating system can comprise a furnace chamber comprising a non-magnetic and non-conductive furnace wall; at least one induction heating coil surrounding an outer side of the furnace wall in a length direction (z) of the furnace chamber; and a holding and pressing construction. The holding and pressing construction can be designed to hold an arrangement to be placed within the furnace chamber, and the holding and pressing construction can apply a pressure on a proximal end and a distal end of the arrangement in the length direction of the chamber.Type: GrantFiled: July 16, 2021Date of Patent: February 13, 2024Assignee: MICROPOWER GLOBAL LIMITEDInventors: Aruna R. Dedigama, Cameron N. Paiga, Alan H. Henderson, Thomas E. Zirkle
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Patent number: 11825745Abstract: A thermoelectric element can comprise a thermoelectric body and a multi-layer contact structure. The multi-layer contact structure can contain a first metal layer overlying a surface of the thermoelectric body and a second metal layer directly overlying the first metal layer, wherein the first metal layer and the second metal layer include the same metal, and the first metal layer has a different phase than the second metal layer.Type: GrantFiled: May 6, 2021Date of Patent: November 21, 2023Assignee: MICROPOWER GLOBAL LIMITEDInventors: Cameron N. Paiga, Aruna R. Dedigama, Alan H. Henderson, Thomas E. Zirkle
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Patent number: 11825746Abstract: A thermoelectric device can comprise at least one first thermoelectric element, at least one second thermoelectric element, and a bridging structure. The bridging structure can include a bridging layer comprising a silver-gallium alloy. The silver-gallium alloy containing a bridging layer can provide flexibility and stress release to the thermoelectric device when subjected to multiple heating cycles, and may have a very low electrical resistance and thermal resistance.Type: GrantFiled: September 23, 2021Date of Patent: November 21, 2023Assignee: MICROPOWER GLOBAL LIMITEDInventors: Aruna R. Dedigama, Adam G. Westerman, Thomas E. Zirkle
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Patent number: 10454013Abstract: A thermoelectric device, module, and system, and method for and method for making is provided. The thermoelectric device (200) having a first and second elements (202 and 204). The first and second elements (202 and 204) having first and second portions (206 and 208), and third and fourth portions (212 and 214) with first and second regions (210 and 216) connected between the first and second portions (206 and 208) and third and fourth portions (112 and 114), respectively. The first and second portions (206 and 208) and third and fourth portions (112 and 114) are electrically coupled though regions (210 and 216) and with thermal conductance between first and second portions (206 and 208) and third and fourth portions (212 and 214) being inhibited by regions (110 and 116), respectively.Type: GrantFiled: November 16, 2012Date of Patent: October 22, 2019Assignee: MICROPOWER GLOBAL LIMITEDInventors: Thomas E. Zirkle, Robert M. Gardner, Robert S. Kilbourn
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Publication number: 20140137918Abstract: A thermoelectric device, module, and system, and method for and method for making is provided. The thermoelectric device (200) having a first and second elements (202 and 204). The first and second elements (202 and 204) having first and second portions (206 and 208), and third and fourth portions (212 and 214) with first and second regions (210 and 216) connected between the first and second portions (206 and 208) and third and fourth portions (112 and 114), respectively. The first and second portions (206 and 208) and third and fourth portions (112 and 114) are electrically coupled though regions (210 and 216) and with thermal conductance between first and second portions (206 and 208) and third and fourth portions (212 and 214) being inhibited by regions (110 and 116), respectively.Type: ApplicationFiled: November 16, 2012Publication date: May 22, 2014Applicant: MICROPOWER GLOBAL LIMITEDInventors: Thomas E. Zirkle, Robert M. Gardner, Robert S. Kilbourn
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Patent number: 7569763Abstract: A solid-state energy converter with a semiconductor or semiconductor-metal implementation is provided for conversion of thermal energy to electric energy, or electric energy to refrigeration. In n-type heat-to-electricity embodiments, a highly doped n* emitter region made of a metal or semiconductor injects carriers into an n-type gap region. A p-type layer is positioned between the emitter region and gap region, allowing for discontinuity of corresponding Fermi-levels and forming a potential barrier to sort electrons by energy. Additional p-type layers can optionally be formed on the collector side of the converter. One type of these layers with higher carrier concentration (p*) serves as a blocking layer at the cold side of the converter, and another layer (p**) with carrier concentration close to the gap reduces a thermoelectric back flow component. Ohmic contacts on both sides of the device close the electrical circuit through an external load to convert heat to electricity.Type: GrantFiled: September 13, 2006Date of Patent: August 4, 2009Assignee: Micropower Global LimitedInventors: Yan R. Kucherov, Peter L. Hagelstein