Abstract: A circuit, and method for using same comprising, a first intermediate memory communicatively coupled with a vector processor and a RAM, wherein the vector processor is communicatively coupled with the RAM, an address sequence memory to store non-linear RAM addresses corresponding to linear locations in the first intermediate memory, a data sequencer to read a first frame of data from the RAM to the first intermediate memory based on addresses stored in the address sequence memory, and the first intermediate memory to provide a linearized frame of data to the vector processor to execute a vector instruction

Abstract: A ReRAM memory array includes ReRAM memory cells and a select circuit having first and second series-connected select transistors connected in series with a ReRAM device. When ReRAM memory cell(s) are selected for programming, the bit line coupled to the ReRAM memory cell(s) to be programmed is biased at a first voltage potential and the source line coupled to the ReRAM memory cell(s) to be programmed is biased at a second voltage potential less than the first voltage potential, the difference between the first voltage potential and the second voltage potential being sufficient to program the ReRAM device. The gates of first and second series-connected select transistors of ReRAM memory cell(s) to be programmed are supplied with positive voltage pulses. The gates of second series-connected select transistors of respective ReRAM memory cell(s) unselected for programming are supplied with a voltage potential insufficient to turn them on.

Abstract: Methods and systems for tamper detection based on power network electrical characteristic by storing a reference electrical signature of a power distribution network comprising the integrated circuit, generating in the integrated circuit a current stimulus waveform by sigma-delta based noise shaping, and providing the waveform to the power distribution network comprising the integrated circuit, sampling the power distribution network with a voltage-to-digital converter in the integrated circuit and estimating based at least partially on the sampled power distribution network a response electrical signature of the power distribution network responsive to the stimulus waveform, comparing on the integrated circuit the estimated response electrical signature and the reference electrical signature, and triggering by the integrated circuit a penalty based on a comparison of the response electrical signature and the reference electrical signature.

Abstract: A ReRAM memory array includes ReRAM memory cells having two series-connected select transistors connected in series with a ReRAM device. When ReRAM memory cell(s) are selected for erasing, the bit line coupled to the ReRAM memory cell(s) to be erased is biased at a first voltage potential. The source line coupled to the ReRAM memory cell(s) to be erased is biased at a second voltage potential greater than the first voltage potential, the difference between the first voltage potential and the second voltage potential being sufficient to erase the ReRAM device. The gates of the series-connected select transistors of the ReRAM memory cell(s) to be erased are supplied with positive voltage pulses. The gates of the series-connected select transistors of the ReRAM memory cell(s) unselected for erasing are supplied with a voltage potential insufficient to turn them on.

Abstract: A method may create RTL for a circuit design utilizing DSP blocks by receiving a software program comprising a multiplication statement to multiply a first number by a second number, the first number having a first data type and a first bit width, the second number having a second data type and a second bit width; determining a number of DSP blocks for implementing the statement based at least on the first bit width, the second bit width, a first DSP bit width corresponding to a bit width of a first operand of the DSP blocks, and a second DSP bit width corresponding to a bit width of a second operand of the DSP blocks, wherein the number of DSP blocks is two or more; and generating RTL for the statement, the RTL comprises a plurality of distinct portions corresponding to each of the two or more DSP blocks.

Abstract: A method for implementing a neural network system in an integrated circuit includes presenting digital pulses to word line inputs of a matrix vector multiplier including a plurality of word lines, the word lines forming intersections with a plurality of summing bit lines, a programmable Vt transistor at each intersection having a gate connected to the intersecting word line, a source connected to a fixed potential and a drain connected to the intersecting summing bit line, each digital pulse having a pulse width proportional to an analog quantity. During a charge collection time frame charge collected on each of the summing bit lines from current flowing in the programmable Vt transistor is summed. During a pulse generating time frame digital pulses are generated having pulse widths proportional to the amount of charge that was collected on each summing bit line during the charge collection time frame.

Abstract: An integrated circuit includes a plurality of low-voltage FinFET transistors each having a channel length l and a channel width w, the low-voltage FinFET transistors having a first threshold voltage channel implant and a first gate dielectric thickness. The integrated circuit also includes a plurality of high-voltage FinFET transistors each having the channel length l and the channel width w, the high-voltage FinFET transistors having a second threshold voltage channel implant greater than the first threshold voltage channel implant and second gate dielectric thickness greater than the first gate dielectric thickness.

Abstract: A method for implementing a neural network system in an integrated circuit includes presenting digital pulses to word line inputs of a matrix vector multiplier including a plurality of word lines, the word lines forming intersections with a plurality of summing bit lines, a programmable Vt transistor at each intersection having a gate connected to the intersecting word line, a source connected to a fixed potential and a drain connected to the intersecting summing bit line, each digital pulse having a pulse width proportional to an analog quantity. During a charge collection time frame charge collected on each of the summing bit lines from current flowing in the programmable Vt transistor is summed. During a pulse generating time frame digital pulses are generated having pulse widths proportional to the amount of charge that was collected on each summing bit line during the charge collection time frame.

Abstract: A single-event-upset (SEU) stabilized memory cell includes a latch portion including a cross-coupled latch, and at least one cross coupling circuit path in the latch portion including a first series-connected pair of vertical resistors.

Abstract: A user programmable integrated circuit includes a user-programmable routing network including a plurality of interconnect conductors selectively couplable to one another by user-programmable elements. A plurality of matrix vector multipliers, each have a plurality of word lines, each word line coupled to a different first one of the one of the interconnect conductors of the user-programmable routing network, the word lines forming intersections with a plurality of summing bit lines, a programmable Vt transistor at each intersection having a gate connected to the intersecting word line, a source connected to a fixed potential and a drain connected to the intersecting summing bit line. A charge-to-pulse-width converter circuit is associated with each one of the matrix vector multipliers, each having an input coupled to one of the summing bit lines, and a pulse output coupled to a different second one of the interconnect conductors of the user-programmable routing network.

Abstract: A random-access memory cell includes first and second voltage supply nodes, first and second complementary output nodes, first and second complementary bit lines associated with the memory cell, and a word line associated with the memory cell. Pairs of series-connected cross-coupled p-channel and n-channel hybrid FinFET transistors are connected between the voltage supply nodes, the first bit line coupled to the first output node, and the second bit line coupled to the second output node.

Abstract: A logic cell for a programmable logic integrated circuit having K function inputs, where K is the largest number such that the logic cell can compute any function of K inputs, and where the logic cell is configurable to implement one bit of a counter in parallel with any independent function of K-1 of the K inputs.

Abstract: A resistive random-access memory device formed on a semiconductor substrate includes a first interlayer dielectric formed over the semiconductor substrate and includes a first via. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A lower metal layer formed in the first via has a top surface extending above a top surface of the chemical-mechanical-polishing stop layer. A dielectric layer is formed over the chemical-mechanical-polishing stop layer and is in electrical contact with the lower metal layer. A barrier metal layer is formed over the dielectric layer. Edges of the dielectric layer and the first barrier metal layer extend beyond outer edges of the first via. A second interlayer dielectric layer including a second via is formed over the dielectric layer. An upper metal layer formed in the second via in electrical contact with the barrier metal layer.

Abstract: A single-event-upset (SEU) stabilized memory cell includes a latch portion including a cross-coupled latch, and at least one cross coupling circuit path in the latch portion including a first series-connected pair of vertical resistors.

Abstract: A configuration memory cell includes a latch portion including a cross-coupled latch having complementary output nodes, and a programmable read-only memory (PROM) portion coupled to one of the complementary output nodes of the latch portion, the PROM portion including a programmable and erasable ReRAM device.

Abstract: A logic cell for a programmable logic integrated circuit having K function inputs, where K is the largest number such that the logic cell can compute any function of K inputs, and where the logic cell is configurable to implement one bit of a counter in parallel with any independent function of K-1 of the K inputs.

Abstract: A method for programming a ReRAM cell including a ReRAM device connected in series with an access transistor includes biasing the ReRAM cell with a programming potential that configures the access transistor in a common-source configuration and applying at least one programming voltage pulse to a gate of the access transistor, the programming voltage pulse having a magnitude selected to limit programming current to a preselected value.

Abstract: A nonvolatile memory cell includes a first voltage supply node, a second voltage supply node, an output node, a resistive random access memory device having a first electrode and a second electrode, the first electrode connected to the first voltage supply node, at least one p-channel transistor connected between the second electrode of the resistive random access memory device and the output node, at least one n-channel transistor connected between the output node and the second voltage supply node, and an inverter connected between the output node and a gate of the at least one n-channel transistor.

Abstract: A method for programming a ReRAM cell including a ReRAM device connected in series with an access transistor includes biasing the ReRAM cell with a programming potential that configures the access transistor in a common-source configuration and applying at least one programming voltage pulse to a gate of the access transistor, the programming voltage pulse having a magnitude selected to limit programming current to a preselected value.

Abstract: A layout is presented for a ReRAM memory cell array including rows and columns of ReRAM cells, each ReRAM cell is in a row and column of ReRAM cells. Each ReRAM cell includes a ReRAM device. A first transistor is coupled between the ReRAM device and a first bit line associated with the column containing the ReRAM cell. The first transistor has a gate coupled to a first word line associated with the row containing the ReRAM cell. A second transistor is coupled between the ReRAM device and a second bit line associated with the column containing the ReRAM cell. The second transistor has a gate coupled to a second word line associated with the row containing the ReRAM cell.