Abstract: A method of producing an acoustically absorbing anisotropic backing structure for an ultrasound transceiver is disclosed. Laser machining of a substrate of acoustically absorbent electrically resistive material produces a set of vias and indented pad seats. The machined substrate is plated with an electrically conductive material. Excess electrically conductive material is removed from the substrate to leave an electrically conductive material plating on the indented pad seats and the vias to form conductive pads and plated vias on the substrate.

Abstract: An improved ultrasound transceiver array for permitting improved imaging is taught. The array may be either a two dimensional array for volumetric imaging or a one dimensional array of elements shaped to permit a more precise beam focus for finer resolution imaging. An Nd:YAG laser is used to machine a workpiece from both ends to produce kerfs which taper inwardly from the transceiving side of the array thereby permitting a stronger ultrasound signal and clearer imaging.

Abstract: An improved ultrasound transceiver array for permitting improved imaging is taught. The array may be either a two dimensional array for volumetric imaging or a one dimensional array of elements shaped to permit a more precise beam focus for finer resolution imaging. An Nd:YAG laser is used to machine a workpiece from both ends to produce kerfs which taper inwardly from the transceiving side of the array thereby permitting a stronger ultrasound signal and clearer imaging.