Patents Assigned to Microspire S.A.
  • Patent number: 7140091
    Abstract: A process for manufacturing an inductive component intended to be installed on a printed circuit involves initially winding an electrically conductive wire to form a winding without using a former end connecting the opposed ends of the winding to inner ends of connecting terminals. The body formed of a block of an insulating material is then over-moulded onto the coil and onto the inner ends of the connecting terminals with the body including a central opening that passes through the body along the axis of the coil. Finally, a core made of ferrite is placed on the body such that the core surrounds the body in a center plane containing the axis of the coil with a center core element passing through the opening in the body.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: November 28, 2006
    Assignee: Microspire S.A.
    Inventor: Jean-François Kummel
  • Publication number: 20020084881
    Abstract: An inductive component intended to be installed on a printed circuit includes at least one winding, a body, and a magnetic core. The winding is made of an electrically conductive wire wound to form a flat coil the ends of which are connected to the inner ends of connecting terminals. The body is formed from a block of insulating material over-molded onto the coil and onto the inner ends of the terminals, the body including a central opening which passes through the body along the axis of the coil. Preferably, the body is made of either a thermosetting epoxy resin or a thermoplastic polymer. The magnetic core is made of a ferrite layer that surrounds the body in a center plane containing the axis of the coil. A center element passes through the opening in the body.
    Type: Application
    Filed: February 28, 2002
    Publication date: July 4, 2002
    Applicant: Microspire S.A.
    Inventor: Jean-Francois Kummel