Abstract: The lower ends of alignment bearing shafts of an upper die member of a tape automated bonding apparatus are modified to include tapered alignment pins, each having a tapered surface that is complementary to the tapered interior end of the bore of a respective bushing on a lower die member. The alignment pin serves to guide its associated alignment shaft and a ball bearing sleeve carried thereby into the bushing. In addition, a first set of rails is installed directly beneath a die member actuator, and a second set of rails is installed on the upper die member. The second set of rails slide upon the first set of rails, so that the upper die member effectively mechanically floats on the first set of rails. The lower die member is affixed to a translatable platen, which is driven to an end stop position at the part excision station. Then, the upper die member is lowered onto the lower die member, so that the alignment pins contact the bores in the bushings on the lower die member.

Abstract: An tape automated bonding feeder apparatus employs a vertical carrier extraction unit to successively supply electronic circuit components to an output station from which a component is seized for placement and attachment to a circuit board. The feeder apparatus, which may be mounted on a rollable cart, includes a generally rectilinear housing on a top plate of which one or more magazines are mounted. A magazine contains a stack of circuit component carriers. The bottom of the magazine has a carrier extraction unit which controllably allows an individual component carrier at the bottom of the stack to drop away onto an underlying carrier shuttle. The carrier shuttle is supported for movement betweeen the magazine and a lead forming unit. The lead forming unit detaches a component from the carrier and forms the leads of the excised component for mounting the component to a circuit board.

Abstract: A surface mount technology measurement and lead formation system provides high precision bending and trimming of offset leads for both two and four sided circuit components. A total form height includes a pair of horizontally adjustable support rails which support the leads of a component. A precision, linear displacement measuring device engages the body of the electronic component and provides a digital indication of the total form height of the leads of the component. The lead forming apparatus has a total form height adjustment mechanism through which the total form height of the leads of the component are controllably bent and trimmed. The total form height of the leads is preset by an operator, who manually adjusts a form height setting anvil, a control dial for which is coupled to an associated digital readout gage which conforms with the same units of the digital readout gage of the total form measuring device.