Abstract: A compact connection assembly and a method for establishing solderfree electrical connections between a main PCB and associated conductors e.g. arranged on a flexible foil strip or on a flexible PCB. The connection assembly is particularly suitable for use in compact electronic equipment such as hearing instruments or mobile phones where one can benefit from the small dimensions obtainable by the described connection assembly.

Abstract: The present invention relates solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment.

Abstract: A flexible substrate transducer assembly integrates a transducer or transducer system with built-in signal processing capability, and a flexible substrate. The flexible substrate provides connectivity between the transducer system and electronic equipment which house the transducer assembly. This assembly is adapted for use in compact equipment such as mobile phones and hearing instruments that benefit from the small outer dimensions achievable for the assembly.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A Micromechanical Microphone is formed with a housing and a transducer therein. The housing has a sound inlet on one side of the transducer and a pressure compensation hole on the opposite side. A sealing diaphragm is placed on each side of the transducer to seal it against humidity, dust and dirt. The transducer may be a capacitive transducer with an external bias or an electret based transducer. The microphone is useful in small devices such as hearing aides.

Abstract: A microelectric position sensor wherein an assembly of magnetic field sensitive elements assume first and second states when subjected to a magnetic field having an intensity below or above first or second predetermined values respectively. A magnet is selectively movable relative to the assembly, so that the elements are selectively subjected to the magnetic field. The magnet has focusing tongues for focusing the magnetic field at a region including substantially only one of the elements, so that the magnetic field within the region has an intensity above the second value, and the magnetic field outside the region has an intensity below the first value.

Abstract: The invention concerns a Switched MAGFET (MAGnetic field sensitive Field Effect Transistor). A preferred SMAGFET embodiment consists of a MAGFET structure with two equal sized drain contacts (3, 4), a gate area consisting of two equal sized and electrically isolated gate regions G1 and G2 (5, 6) separated by a third isolated gate region Gc (7) placed along the symmetry line of the device and slightly overlapping G1 and G2. The SMAGFET has a common source (1). By varying the gate voltage on Gc (with reference to the common source contact), the magnetic sensitivity of the SMAGFET may be controlled. By applying a first voltage on Gc, exchange of carriers from the channels beneath G1 and G2 is blocked. In case of an applied magnetic field, this will prevent Lorentz deflected carriers to cross symmetry line and redistribute the drain currents, i.e. the magnetic field sensitivity is virtually zero as the drain currents will remain unaffected by the magnetic induction.

Abstract: An electromechanical pulse gereator having a purely mechanical mode of operation for microelectronic equipment, e.g. volume control in hearing aids, consisting of a housing formed by a fixed base portion in which a shaft is fixedly mounted and a timing wheel is rotatably mounted around the shaft, the timing wheel having the form of a downward facing open cylinder and being fixedly connected to a casing whci forms an external handle. The inner cylinder surface of the timing wheel is provided with grooves engaging with a protrusion of a circular carrier rotatably mounted around the shaft. A U-shaped contact spring has members which are individually imparted an oscillating movement between contact pairs A-B-C and A-D-E, respectively, by the turn of the timing wheel in one or the other direction via the carrier which can only move over a pre-determined circular section, so as to generate digital pulse trains.

Abstract: An electroacoustic transducer comprises a pair of active piezo electric membranes and a sleeve closed at its ends by the membranes to a form an enclosed rear volume of air. A case accomodates the assembly of sleeve and membranes and provides an enclosed front volume of air between its inner wall and the assembly. An opening in the case to the outside forms a sound pressure output. Each membrane comprises a sandwich of two active piezo layers on a substrate material. Very small thicknesses of the substrate and active piezo layers provides for a correct impedance match to the acoustic load in the ear when used in hearing aids.