Patents Assigned to Microwave Power, Inc.
  • Solid state power amplifier with planar structure
    Patent number: 5838201
    Abstract: A solid state power amplifier which combines the output of several power modules by means of a waveguide radial combiner. The physical structure of the amplifier is such that the power modules lay flat on a planar heat sink which can be easily cooled by forced air. The input power can be distributed to the power modules by means of a microstrip divider. The divider can be connected to the modules by means of coaxial cables and the modules can be connected to the radial combiner by means of microstrip to waveguide transitions.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: November 17, 1998
    Assignee: Microwave Power Inc.
    Inventor: Franco Nicola Sechi
  • Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes
    Patent number: 5023994
    Abstract: A method of forming a microwave integrated circuit substrate which includes via holes connecting the upper and lower surfaces of the substrate in which the upper end of the via hole is closed by a conductive membrane.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: June 18, 1991
    Assignee: Microwave Power, Inc.
    Inventors: Marina Bujatti, Franco N. Sechi
  • Microwave integrated circuit substrate including metal filled via holes and method of manufacture
    Patent number: 4925723
    Abstract: The present invention is directed to a microwave integrated circuit formed on a substrate having via holes for either electrical grounding or heat dissipation or both and more particularly to a substrate including via holes which are filled with metal.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: May 15, 1990
    Assignee: Microwave Power, Inc.
    Inventors: Marina Bujatti, Franco N. Sechi