Patents Assigned to Microwave Power, Inc.
  • Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes
    Patent number: 5023994
    Abstract: A method of forming a microwave integrated circuit substrate which includes via holes connecting the upper and lower surfaces of the substrate in which the upper end of the via hole is closed by a conductive membrane.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: June 18, 1991
    Assignee: Microwave Power, Inc.
    Inventors: Marina Bujatti, Franco N. Sechi
  • Microwave integrated circuit substrate including metal filled via holes and method of manufacture
    Patent number: 4925723
    Abstract: The present invention is directed to a microwave integrated circuit formed on a substrate having via holes for either electrical grounding or heat dissipation or both and more particularly to a substrate including via holes which are filled with metal.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: May 15, 1990
    Assignee: Microwave Power, Inc.
    Inventors: Marina Bujatti, Franco N. Sechi