Abstract: A method for manufacturing a plurality of fingerprint identification modules simultaneously is provided. A first thin film and a second thin film are formed on a first transfer base and a second transfer base respectively. The first thin film and the second thin film are cut respectively to form a plurality of first thin film units and a plurality of second thin film units. The first transfer base and the second transfer base are adhered on opposite surfaces of a substrate. The first thin film units and the second thin film units are cut respectively to form a plurality of the first piezoelectric layers and a plurality of the second piezoelectric layers. A plurality of first slits and a plurality of second slits are formed on opposite surfaces of the substrate for breaking the mother base into the fingerprint identification modules.

Abstract: An ultrasonic sensor includes a substrate. A first electrode and a first piezoelectric layer are stacked on one side of the substrate. A second electrode and a second piezoelectric layer are stacked on the other side of the substrate. A notch is defined in the first piezoelectric layer. And a conductive film is coated within the notch to couple the first electrode and the first piezoelectric layer.

Abstract: An ultrasonic sensor includes a first electrode, a first piezoelectric layer, a substrate, a second electrode, a second piezoelectric layer, and a third electrode. The first electrode and the first piezoelectric layer are stacked on a first surface of the substrate. The second electrode, the second piezoelectric layer, and the third electrode are stacked on a second surface opposite to the first surface of the substrate. The substrate is made of chemically strengthened glass.

Abstract: A fingerprint identification apparatus includes a fingerprint identification module and a signal transmitting module electrically connected to the fingerprint identification module. The signal transmitting module includes a loading substrate and a first sensing layer with a plurality of first sensing units. The first sensing units are located on the loading substrate in a matrix. Each corner of the first sensing units is a substantially arc shaped.

Abstract: The present disclosure provides a fingerprint identification unit. The fingerprint identification unit includes a substrate, a reception layer, a first electrode layer, a transmission layer, a second electrode layer, and a third electrode layer. The reception layer is positioned at one side of the substrate. The first electrode layer is formed on the reception layer. The transmission layer is positioned at another side of the substrate opposite to the reception layer. The second electrode layer and the third electrode layer are formed on two opposite sides of the transmission layer respectively. The reception layer and the transmission layer are made of piezoelectric materials. At least one of the first electrode layer, the second electrode layer, and the third electrode layer is a transparent conductive layer.