Patents Assigned to Mikado Technos Co., Ltd.
  • Patent number: 9451708
    Abstract: A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer having a good thickness under an appropriate pressing pressure, while suppressing runout of the adhesive as much as possible, with a pressing force being slightly adjustable. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: September 20, 2016
    Assignee: MIKADO TECHNOS CO., LTD.
    Inventors: Takashi Ito, Hiroki Sato
  • Publication number: 20140033518
    Abstract: A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure. A vacuum chamber is evacuated to vacuum, and the lower plate member and an intermediate member are relatively moved in an approaching direction, so that an outer peripheral portion of the pressurizing release film is gas-tightly held between the upper face of the substrate-placing table of the lower plate member and a lower face of an inner frame body.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 6, 2014
    Applicant: MIKADO TECHNOS CO., LTD.
    Inventors: Takashi Ito, Hiroki Sato
  • Patent number: 7966966
    Abstract: The present invention proposes a vacuum/high pressure filling apparatus which can improve the filling rate and shorten the impregnating time period in immersing a porous workpiece into a filling liquid. The vacuum/high pressure filling apparatus includes: an openable and closable hermetic partition chamber unit constituted by two upper and lower split partition wall unit portions, a partition chamber unit opening and closing mechanism to open and close the partition chamber unit, a vacuum suction opening and a pressurizing opening provided for the partition chamber unit, a liquid vessel arranged in the partition chamber unit to receive a filling liquid, a holder arranged, in the partition chamber unit, for the porous workpiece, an elevator unit to move the filling liquid in the liquid vessel and the porous workpiece relative to each other inside the partition chamber unit so as to immerse the porous workpiece into the filling liquid in the liquid vessel and pull up the workpiece from the filling liquid.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: June 28, 2011
    Assignee: Mikado Technos Co., Ltd.
    Inventor: Hidetoshi Ito
  • Publication number: 20090151576
    Abstract: A hot press apparatus for hot pressing a thin plate-like workpiece, includes a base 1, lower and upper heating plates 4, 16, a flat lower mold member 8, lower and upper frame members 10, 18, a workpiece taking-out unit 7, an upper press plate 12, a heat-resistant and stretchable film member 19 covering the lower end portion of the upper frame member 18, a heat medium M filled in a heat medium-filling space above the film member, and a driving unit 13. A film member-horizontally holding member 20 substantially horizontally holds the film member while preventing the film member from hanging, while keeping it at a substantially constant position as viewed in a horizontal direction. The workpiece is hot pressed with the film member by applying pressure to the heat medium inside the heat medium-filling space while the film member is prevented from expanding radially outwardly at an outer periphery thereof.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 18, 2009
    Applicant: MIKADO TECHNOS CO., LTD.
    Inventor: HIDETOSHI ITO
  • Patent number: 7195476
    Abstract: A heating-type vacuum press device which has a small vacuum isolation chamber in which pressing is performed under vacuum without damage to seal packing, while heating. A lower fixed frame and an upper movement frame constitute a wall portion of the isolation chamber. A gas-tight sliding mechanism ensures gas-tightness between the lower fixed frame and the upper movement frame. Thereby, the isolation chamber is formed in a space defined by the lower fixed frame, the upper movement frame, a base and a fitting plate. The lower fixed frame surrounds a receiving table equipped with a heater for a workpiece, and is arranged on the base such that the lower fixed frame is spaced from the receiving table. The upper movement frame is hanged from the fitting plate such that the upper movement frame is spaced from a pressing plate equipped with a heater, and surrounds the pressing plate.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: March 27, 2007
    Assignee: Mikado Technos Co., Ltd.
    Inventor: Hidetoshi Ito