Abstract: The electroplating equipment disposes a hollow first ring between a first mold and a through hole of a workpiece, and a hollow second ring between a second mold and the through hole of the workpiece, such that the first ring and the second ring provide substantially equivalent channel as the openings of the through hole when the first mold and the second mold are set to hold tight the workpiece. The first ring and the second ring, along with an injection channel of the first mold and a recycling channel of the second mold and the through hole of the workpiece, form a seamless flow channel for an electroplating fluid to flow and be electroplated on the wall of the through hole.